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Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing

Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park

J Weld Join. 2021;39(4):368-375. Published online 2021 August 26 DOI: https://doi.org/10.5781/JWJ.2021.39.4.4

Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing

Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park

Journal of Welding and Joining. 2021;39(4):368-375

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Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test

Myeongin Kim, Won Sik Hong, Mi-Song Kim

Journal of Welding and Joining. 2022;40(3):271-277

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Analysis of Void Formation Mechanism in the Vacuum Reflow Soldering Process of Semiconductor Laser Diode

Peidong Xu, Bin Wang, Yong Wang, Xiantao Wang

. 2021;

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Analysis of Void Formation Mechanism in the Vacuum Reflow Soldering Process of Semiconductor Laser Diode

Peidong Xu, Bin Wang, Yong Wang, Xiantao Wang

. 2021;

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MEMS-based Ni–B probe with enhanced mechanical properties for fine pitch testing

Kyongtae Kim, Hong-Beom Kwon, Hye-Rin Ahn, Yong-Jun Kim

Micro and Nano Systems Letters. 2017;5(1):

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Advances in photonic crystals with MEMS and with semiconductor quantum dots

S. Iwamoto, Y. Arakawa

Laser Physics. 2006;16(2):223-231

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Fingertip sized external cavity quantum cascade laser based on MEMS grating

Atsushi Sugiyama, Takahide Ochiai, Kyosuke Nagasaka, Tatsuo Dougakiuchi, Tadataka Edamura, Naota Akikusa

2022 28th International Semiconductor Laser Conference (ISLC). 2022;

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Testing a generalized Siegert relation for characterizing semiconductor nanolaser emission

Monty Drechsler, Frederik Lohof, Christopher Gies

2022 28th International Semiconductor Laser Conference (ISLC). 2022;

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Strong coupling, Rabi oscillations, and quantum properties of femtosecond superradiant emission from semiconductor laser heterostructures

Peter P. Vasil'ev, Richard V. Penty

2022 28th International Semiconductor Laser Conference (ISLC). 2022;

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4523144 Complex probe card for testing a semiconductor wafer

Masao Okubo, Yasuro Yoshimitsu

Microelectronics Reliability. 1986;26(1):202

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