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Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing
Mi-Song Kim, Won Sik Hong, Myeongin Kim
J Weld Join. 2021;39(4):359-367.   Published online 2021 August 23    DOI: https://doi.org/10.5781/JWJ.2021.39.4.3

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Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing
Journal of Welding and Joining. 2021;39(4):359-367   Crossref logo
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Bump formation for flip chip and CSP by solder paste printing
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Flip Chip Solder Bonding for Microelectronic Applications
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A multichip package utilizing In-Cu flip-chip bonding
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Laser Ultrasonic Inspection of Solder Bumps in Flip-Chip Packages Using Virtual Chip Package as Reference
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Ceramic chip scale package solder joint reliability
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Phase Array Ultrasonic Transducer Based on a Flip Chip Bonding with Indium Solder Bump
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