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Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing
Mi-Song Kim, Won Sik Hong, Myeongin Kim
JWJ. 2021;39(4):359-367.   Published online 2021 August 23    DOI: https://doi.org/10.5781/JWJ.2021.39.4.3

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Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing
Journal of Welding and Joining. 2021;39(4):359-367   Crossref logo
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Bump formation for flip chip and CSP by solder paste printing
Microelectronics Reliability. 2002;42(3):391-398   Crossref logo
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A multichip package utilizing In-Cu flip-chip bonding
Microelectronics Reliability. 1970;9(4):320   Crossref logo
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Effects of chip scale package and flip‐chip on the design and manufacturing of electronic products
Microelectronics International. 1998;15(1):35-38   Crossref logo
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Ceramic chip scale package solder joint reliability
Soldering & Surface Mount Technology. 2001;13(3):7-11   Crossref logo
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Strain behaviors of solder bump with underfill for flip chip package under thermal loading condition
Journal of Mechanical Science and Technology. 2014;28(12):4899-4906   Crossref logo
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Chip Scale Package (CSP) solder joint reliability and modeling
Microelectronics Reliability. 1999;39(4):463-477   Crossref logo
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Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package)
Microelectronics Reliability. 2005;45(12):1916-1923   Crossref logo
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Pb‐free solder bumping for flip chip package by electroplating
Soldering & Surface Mount Technology. 2003;15(2):10-16   Crossref logo
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The numerical analysis of strain behavior at the solder joint and interface in a flip chip package
Journal of Materials Processing Technology. 2006;171(1):125-131   Crossref logo
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