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A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste
Jeong-Won Yoon, Dong-Hwan Lee, Byung-Suk Lee
JWJ. 2021;39(4):376-383.   Published online 2021 August 23    DOI: https://doi.org/10.5781/JWJ.2021.39.4.5

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A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste
Journal of Welding and Joining. 2021;39(4):376-383   Crossref logo
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Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles
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Pressureless transient liquid phase bonding using SAC305 with hybrid Ag particles and its reliability under high-temperature storage test
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A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint
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A study of transient liquid-phase bonding of Ag-Cu using differential scanning calorimetry
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A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding
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A review: Formation of voids in solder joint during the transient liquid phase bonding process - Causes and solutions
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Transient liquid phase bonding for solder-a short review
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Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for Cu Ni bonding
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Lead contamination of a transient liquid-phase-processed Sn-Bi lead-free solder paste
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