CrossRef Text and Data Mining
Result of CrossRef Text and Data Mining Search is the related articles with entitled article. If you click link1 or link2 you will be able to reach the full text site of selected articles; however, some links do not show the full text immediately at now. If you click CrossRef Text and Data Mining Download icon, you will be able to get whole list of articles from literature included in CrossRef Text and Data Mining.
A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste
Jeong-Won Yoon, Dong-Hwan Lee, Byung-Suk Lee
J Weld Join. 2021;39(4):376-383.   Published online 2021 August 23    DOI: https://doi.org/10.5781/JWJ.2021.39.4.5

Excel Download

A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste
Journal of Welding and Joining. 2021;39(4):376-383   Crossref logo
Link1 Link2 Link3

The transient liquid phase bonding by ultrasonic-assisted soldering of Cu contained Sn-58Bi solder paste for high-temperature packaging applications
2022 International Conference on Electronics Packaging (ICEP). 2022;   Crossref logo
Link1

Pressureless transient liquid phase sintering bonding using SAC305 with hybrid Ag particles for high–temperature packaging applications
2020 IEEE 70th Electronic Components and Technology Conference (ECTC). 2020;   Crossref logo
Link1

Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles
Archives of Metallurgy and Materials. 2017;62(2):1143-1148   Crossref logo
Link1 Link2

A study of transient liquid-phase bonding of Ag-Cu using differential scanning calorimetry
Metallurgical and Materials Transactions A. 2006;37(8):   Crossref logo
Link1 Link2 Link3 Link4

Low Temperature Transient Liquid Phase (TLP) Bonding using Eutectic Sn-In Solder Anisotropic Condctive Films (ACFs) for Flexible Ultrasound Transducer
2019 IEEE 69th Electronic Components and Technology Conference (ECTC). 2019;   Crossref logo
Link1

A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint
Metallurgical Transactions A. 1988;19(3):675-686   Crossref logo
Link1 Link2 Link3

A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding
Scripta Materialia. 2015;109:113-117   Crossref logo
Link1 Link2

Process Developments in Transient Liquid Phase Bonding of Bi-Ni for High-Temperature Pb-Free Solder Alternatives
2021 IEEE 71st Electronic Components and Technology Conference (ECTC). 2021;   Crossref logo
Link1

A review: Formation of voids in solder joint during the transient liquid phase bonding process - Causes and solutions
Microelectronics Reliability. 2019;98:95-105   Crossref logo
Link1 Link2

This metadata service is kindly provided by CrossRef from May 29, 2014. J Weld Join has participated in CrossRef Text and Data Mining service since October 29, 2014.