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Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging
Mi-Song Kim, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, Jeong Tak Moon
JWJ. 2021;39(4):343-348.   Published online 2021 August 11    DOI: https://doi.org/10.5781/JWJ.2021.39.4.1

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Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging
Journal of Welding and Joining. 2021;39(4):343-348   Crossref logo
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Effect of Continuous Casting Parameters on Microstructure and Texture of Gold Bonding Wire for Semiconductor Packaging
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The ultrasonic welding mechanism as applied to aluminium- and gold-wire bonding in microelectronics
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Cost-effective Use of Gold Wire in Semiconductor Packaging
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High-Speed Bonding of Resin-Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil
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Short-circuit diffusion of ultrasonic bonding interfaces in microelectronic packaging
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Thermoelectric Mechanism and Interface Characteristics of Cyanide-Free Nanogold-Coated Silver Wire
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