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Three-Dimesnional Semicondoctor Stacking using TSV(Through-Si-Via) Technology
Do Hoon Cho, Hye Jun Kang, Seong Min Seo, Jang Baeg Kim, Sri Harini Rajendran, Jae Pil Jung
JWJ. 2021;39(3):295-303.   Published online 2021 May 17    DOI: https://doi.org/10.5781/JWJ.2021.39.3.8

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Three-Dimesnional Semicondoctor Stacking using TSV(Through-Si-Via) Technology
Journal of Welding and Joining. 2021;39(3):295-303   Crossref logo
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Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)
Nanoscale Research Letters. 2017;12(1):   Crossref logo
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Development of three-dimensional chip stacking technology using a clamped through-silicon via interconnection
Microelectronics Reliability. 2010;50(4):489-497   Crossref logo
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Heterogeneous Integration of LSI Amplifier and the Tactile Sensor Using Stacking and Through-Si-Via Techniques
MRS Proceedings. 2012;1427:   Crossref logo
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Multi-TSV (Through Silicon Via) Error Detection Using the Non-contact Probing Method
Studies in Computational Intelligence. 2019;47-56   Crossref logo
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Through Silicon Via (TSV) defect investigations using lateral emission microscopy
Microelectronics Reliability. 2010;50(9-11):1413-1416   Crossref logo
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A study of the mechanisms causing surface defects on sidewalls during Si etching for TSV (through Si via)
Journal of Micromechanics and Microengineering. 2013;23(6):065005   Crossref logo
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Thermal Effects Analysis of Flip Chip LED Packages with through Silicon via (TSV) by Using Numerical Simulation
Applied Mechanics and Materials. 2013;459:289-294   Crossref logo
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Effect of silicon anisotropy on interfacial fracture for three dimensional through-silicon-via (TSV) under thermal loading
Engineering Fracture Mechanics. 2019;209:274-300   Crossref logo
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A novel model for through-silicon via (TSV) filling process simulation considering three additives and current density effect
Journal of Micromechanics and Microengineering. 2017;27(12):125017   Crossref logo
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