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Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration
Sujong Kim, Wonsik Hong, Hyunbin Nam, Namhyun Kang
J Weld Join. 2021;39(1):89-102.   Published online 2021 February 26    DOI: https://doi.org/10.5781/JWJ.2021.39.1.11

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Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration
Journal of Welding and Joining. 2021;39(1):89-102   Crossref logo
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Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with ENEPIG Surface Finish
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Electromigration-enhanced intermetallic growth and phase evolution in Cu/Sn–58Bi/Cu solder joints
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Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints
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Effect of Intermetallic Compound Growth on Electromigration Failure Mechanism in Low-Profile Solder Joints
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