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Recent Low Temperature Solder of SnBi and Its Bonding Characteristics

Hyejun Kang, Bumgyu Baek, Jae Pil Jung

J Weld Join. 2020;38(6):576-583. Published online 2020 December 3 DOI: https://doi.org/10.5781/JWJ.2020.38.6.8

Recent Low Temperature Solder of SnBi and Its Bonding Characteristics

Hyejun Kang, Bumgyu Baek, Jae Pil Jung

Journal of Welding and Joining. 2020;38(6):576-583

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Ultra-broadband Integrated Capacitive Silicon Interposer assembled with SnBi Eutectic Solder

Charles Muller, Mohamed Mehdi Jatlaoui, Mickael Pommier

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). 2021;

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Hybrid SnBi/SAC Low-Temperature Solder Bump

Albert T. Wu, Jui-Lin Chao, Yu-Yuan Lai, Chang-Meng Wang

2023 International Conference on Electronics Packaging (ICEP). 2023;

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Recent advances on SnBi low-temperature solder for electronic interconnections

Nan Jiang, Liang Zhang, Li-Li Gao, Xiao-Guo Song, Peng He

Journal of Materials Science: Materials in Electronics. 2021;32(18):22731-22759

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Bonding Characteristics of Sn-57Bi-1Ag Low-Temperature Lead-Free Solder to Gold-Plated Copper

Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama

Procedia Engineering. 2017;184:223-230

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Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics

Hyejun Kang, Sri Harini Rajendran, Jae Pil Jung

Metals. 2021;11(2):364

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Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections

Guang Ren, Ian J. Wilding, Maurice N. Collins

Journal of Alloys and Compounds. 2016;665:251-260

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Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Sang Hoon Kim, Sangsun Yang

Recent Progress in Soldering Materials. 2017;

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Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q

Bart Vandevelde, Riet Labie, Ralph Lauwaert, Daniel Werkhoven, Daniel Vanderstraeten, Eddy Blansaer, Jonas Lannoo, Davy Pissoort

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). 2019;

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Low temperature bonding for high temperature applications by using SnBi solders

T.L. Yang, J.Y. Wu, C.C. Li, S. Yang, C.R. Kao

Journal of Alloys and Compounds. 2015;647:681-685

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