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Strategies to Reduce Transient Liquid Phase Bonding Time for the Die Attach of Power Semiconductors

Sunghyun Sohn, Daewon Kim, Hongpyo Kim, Namhyun Kang

J Weld Join. 2020;38(2):158-165. Published online 2020 April 29 DOI: https://doi.org/10.5781/JWJ.2020.38.2.5

Transient Liquid Phase Bonding

J. R. Holaday, C. A. Handwerker

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging. 2019;197-249

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Correction to: Transient Liquid Phase Bonding

J. R. Holaday, C. A. Handwerker

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging. 2019;C1-C1

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Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging

Byung-Suk Lee, Soong-Keun Hyun, Jeong-Won Yoon

Journal of Materials Science: Materials in Electronics. 2017;28(11):7827-7833

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Thermo-Mechanical Characterization of Au-In Transient Liquid Phase Bonding Die-Attach

B. J. Grummel, Z. J. Shen, H. A. Mustain, A. R. Hefner

IEEE Transactions on Components, Packaging and Manufacturing Technology. 2013;3(5):716-723

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Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach

Jianhao Wang, Xunda Liu, Fupeng Huo, Kento Kariya, Noriyuki Masago, Hiroshi Nishikawa

Materials Research Bulletin. 2022;149:111713

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Transient Liquid Phase Die Attach for High-Temperature Silicon Carbide Power Devices

Habib A. Mustain, William D. Brown, Simon S. Ang

IEEE Transactions on Components and Packaging Technologies. 2010;33(3):563-570

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Transient Liquid Phase Bonding

CIRP Encyclopedia of Production Engineering. 2019;1752-1752

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Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach

Hiroaki Tatsumi, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose

Applied Sciences. 2019;9(17):3476

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Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding

F. Emadi, S. Liu, A. Klami, N. Tiwary, V. Vuorinen, M. Paulasto-Krockel

2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM). 2022;

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Silver Die Attach Bonding

CIRP Encyclopedia of Production Engineering. 2019;1565-1565

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