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Laser-Assisted Bonding (LAB), Its Bonding Materials, and Their Applications
Kwang-Seong Choi, Jiho Joo, Ki-seok Jang, Gwang-Mun Choi, Ho-Gyeong Yun, Seok Hwan Moon, Yong-Sung Eom
J Weld Join. 2020;38(2):138-144.   Published online 2020 April 29    DOI: https://doi.org/10.5781/JWJ.2020.38.2.2

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Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 2022;   Crossref logo
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Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die chip packages
2020 IEEE 70th Electronic Components and Technology Conference (ECTC). 2020;   Crossref logo
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Next Gen Laser Assisted Bonding (LAB) Technology
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 2022;   Crossref logo
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Layer Transfer by Bonding and Laser Lift-Off
Springer Series in MATERIALS SCIENCE. 2004;377-415   Crossref logo
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A study on laser-assisted bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs
2020 IEEE 70th Electronic Components and Technology Conference (ECTC). 2020;   Crossref logo
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Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding
Springer Series in MATERIALS SCIENCE. 2004;1-60   Crossref logo
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High-Performance Flip Chip Bonding Mechanism Study with Laser Assisted Bonding
2020 IEEE 70th Electronic Components and Technology Conference (ECTC). 2020;   Crossref logo
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Study on Thermal Assisted Direct Bonding of Glasses for Lab-on-Chip Application through Surface Activation Process
Advanced Materials Research. 2011;327:124-129   Crossref logo
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Bonding and Molecular Spectroscopy
Physical Chemistry and its Biological Applications. 1978;288-337   Crossref logo
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Wafer Bonding of Ferroelectric Materials
Springer Series in MATERIALS SCIENCE. 2004;451-471   Crossref logo
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