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Laser-Assisted Bonding (LAB), Its Bonding Materials, and Their Applications

Kwang-Seong Choi, Jiho Joo, Ki-seok Jang, Gwang-Mun Choi, Ho-Gyeong Yun, Seok Hwan Moon, Yong-Sung Eom

J Weld Join. 2020;38(2):138-144. Published online 2020 April 29 DOI: https://doi.org/10.5781/JWJ.2020.38.2.2

Reverse Laser Assisted Bonding (R-LAB) Technology for Chiplet Module Bonding on Substrate

SeokHo Na, MinHo Gim, GaHyeon Kim, DongSu Ryu, DongJoo Park, JinYoung Kim

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC). 2022;

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Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era

Kwang-Seong Choi, Jiho Joo, Gwang-Mun Choi, Ho-Gyeong Yun, Seok Hwan Moon, Ki-seok Jang, Chanmi Lee, Jin-Hyuk Oh, In-Seok Kye, Yoon-Hwan Moon, Yong-Sung Eom

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 2022;

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Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die chip packages

Matthias Fettke, Timo Kubsch, Andrej Kolbasow, Vinith Bejugam, Alexander Frick, Thorsten Teutsch

2020 IEEE 70th Electronic Components and Technology Conference (ECTC). 2020;

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Next Gen Laser Assisted Bonding (LAB) Technology

SeokHo Na, MinHo Gim, ChoongHoe Kim, DongHyeon Park, DongSu Ryu, DongJoo Park, JinYoung Khim

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 2022;

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Layer Transfer by Bonding and Laser Lift-Off

T. D. Sands, W. S. Wong, N. W. Cheung

Springer Series in MATERIALS SCIENCE. 2004;377-415

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A study on laser-assisted bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs

Matthias Fettke, Andrej Kolbasow, Vinith Bejugam, Timo Kubsch, Alexander Frick, Thorsten Teutsch, Yu-Chung Wang, Juha Rantala

2020 IEEE 70th Electronic Components and Technology Conference (ECTC). 2020;

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Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding

J. Haisma

Springer Series in MATERIALS SCIENCE. 2004;1-60

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High-Performance Flip Chip Bonding Mechanism Study with Laser Assisted Bonding

MinHo Gim, ChoongHoe Kim, SeokHo Na, DongSu Ryu, KyungRok Park, JinYoung Kim

2020 IEEE 70th Electronic Components and Technology Conference (ECTC). 2020;

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Adhesive Bonding Technology: Fields of Application

Adhesive Bonding. 2008;205-369

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The Historical Development of Adhesive Bonding

Adhesive Bonding. 2008;5-10

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