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Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test
Materials Science Forum. 2007;544-545:621-624
Finite element analysis of underfill effect on the CBGA package reliability under thermal cycling
2022 23rd International Conference on Electronic Packaging Technology (ICEPT). 2022;
Effect of NC pins ESD test on the reliability of integrated circuits with high density BGA package
Microelectronics Reliability. 2022;139:114844
Reliability evaluations of flip chip package under thermal shock test
Microelectronic Engineering. 2005;82(3-4):575-580
Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test
Microelectronics Reliability. 2020;112:113918
The Finite Element Model of the Effect of the Interface Behavior of Corner Bond on the Reliability of the BGA Package under Thermal Cycling
2020 21st International Conference on Electronic Packaging Technology (ICEPT). 2020;
Evaluation of solder joint reliability in flip chip package under thermal shock test
Thin Solid Films. 2006;504(1-2):426-430
Effect of glue on reliability of flip chip BGA packages under thermal cycling
Microelectronics Reliability. 2010;50(7):1000-1006
Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending
Microelectronics Reliability. 2011;51(9-11):1850-1855