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Optimum Process Condition and Shear Strength of Transient Liquid Phase Bonded Cu/Sn/Ag and Ni/Sn/Ag Structures for Power Semiconductor Interconnect
Sunghyun Sohn, Jeonga Kim, Yujin Park, Kyung Mox Cho, Namhyun Kang
J Weld Join. 2019;37(4):363-368.   Published online 2019 August 28    DOI: https://doi.org/10.5781/JWJ.2019.37.4.11

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Optimum Process Condition and Shear Strength of Transient Liquid Phase Bonded Cu/Sn/Ag and Ni/Sn/Ag Structures for Power Semiconductor Interconnect
Journal of Welding and Joining. 2019;37(4):363-368   Crossref logo
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Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects – A novel approach for hybrid metal baseplates
Microelectronics Reliability. 2018;88-90:774-778   Crossref logo
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The shear strength of transient liquid phase bonded Sn–Bi solder joint with added Cu particles
Advanced Powder Technology. 2016;27(3):1000-1005   Crossref logo
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Improving the shear strength of Sn–Ag–Cu–Ni/Cu–Zn solder joints via modifying the microstructure and phase stability of Cu–Sn intermetallic compounds
Intermetallics. 2014;54:181-186   Crossref logo
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Growth of intermetallics between Sn/Ni/Cu, Sn/Ag/Cu and Sn/Cu layered structures
Thin Solid Films. 2014;556:345-353   Crossref logo
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ChemInform Abstract: Supplemental Literature Review of Binary Phase Diagrams: Ag-Ho, Ag-Tb, Ag-Y, Cd-Na, Ce-Sn, Co-Dy, Cu-Dy, Cu-Sn, Ir-Pt, Mg-Pb, Mo-Ni, and Sc-Y
ChemInform. 2014;45(27):no-no   Crossref logo
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Interfacial Microstructure and Joint Strength of Sn-Ag and Sn-Ag-Cu Lead Free Solders Reflowed on Cu/Ni-P/Au Metallization
Materials Science Forum. 2006;512:355-360   Crossref logo
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Supplemental Literature Review of Binary Phase Diagrams: Ag-Ho, Ag-Tb, Ag-Y, Cd-Na, Ce-Sn, Co-Dy, Cu-Dy, Cu-Sn, Ir-Pt, Mg-Pb, Mo-Ni, and Sc-Y
Journal of Phase Equilibria and Diffusion. 2014;35(2):208-219   Crossref logo
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Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process
Acta Materialia. 2010;58(9):3429-3443   Crossref logo
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Liquid and solid state interfacial reactions of Sn–Ag–Cu and Sn–In–Ag–Cu solders with Ni–P under bump metallization
Thin Solid Films. 2006;504(1-2):431-435   Crossref logo
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