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Influence of Reductant Content within the Solderable Polymer Composite on the Coalescence and Wetting Behaviors of Low-Melting-Point Alloy Fillers
Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
J Weld Join. 2019;37(1):76-81.   Published online 2019 January 24    DOI: https://doi.org/10.5781/JWJ.2019.37.1.10

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Influence of Reductant Content within the Solderable Polymer Composite on the Coalescence and Wetting Behaviors of Low-Melting-Point Alloy Fillers
Journal of Welding and Joining. 2019;37(1):76-81   Crossref logo
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Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers
Journal of Welding and Joining. 2022;40(3):242-247   Crossref logo
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Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers
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Three-dimensional multi-layer through-hole filling properties of solderable polymer composites with low-melting-point alloy fillers
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Self-interconnection characteristics of hybrid composite with low-melting-point alloy fillers
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Effect of nano-fillers on conductivity of polyethylene/low melting point metal alloy composites
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Novel low melting point alloy-loaded polymer composite. II. Resistivity-temperature behavior
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Isotropic conductive adhesives filled with low-melting-point alloy fillers
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A novel low-melting-point alloy-loaded polymer composite. I. Effect of processing temperature on the electrical properties and morphology
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An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler
Microelectronics Reliability. 2014;54(12):2944-2950   Crossref logo
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