CrossRef Text and Data Mining

Result of CrossRef Text and Data Mining Search is the related articles with entitled article. If you click link1 or link2 you will be able to reach the full text site of selected articles; however, some links do not show the full text immediately at now. If you click CrossRef Text and Data Mining Download icon, you will be able to get whole list of articles from literature included in CrossRef Text and Data Mining.

Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints

Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon

J Weld Join. 2018;36(5):52-60. Published online 2018 September 17 DOI: https://doi.org/10.5781/JWJ.2018.36.5.7

Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints

Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon

Journal of Welding and Joining. 2018;36(5):52-60

Link1

Link2 Link3

Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish

Young Min Kim, Jin-Young Park, Young-Ho Kim

Journal of Electronic Materials. 2012;41(4):763-773

Link1

Link2 Link3

Effect of Ni(P) thickness of ultrathin ENEPIG on the interfacial reaction and board level reliability of solder joints

Yibo Wang, Hongfa Pan, Charles Nan-Cheng Chen, Ming Li, Liming Gao

2020 IEEE 70th Electronic Components and Technology Conference (ECTC). 2020;

Link1

Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn–3Cu/Cu single crystal joints

H.F. Zou, Z.F. Zhang

Microelectronic Engineering. 2010;87(4):601-609

Link1 Link2

Interfacial reaction and intermetallic compound formation of Sn–1Ag/ENIG and Sn–1Ag/ENEPIG solder joints

Jeong-Won Yoon, Jung-Hwan Bang, Chang-Woo Lee, Seung-Boo Jung

Journal of Alloys and Compounds. 2015;627:276-280

Link1 Link2

Effect of Temperature and Solder Thickness on Interfacial Reaction in Cu/Sn/Ni Solder Joints Formed by TLP Bonding

Hong Wei, Zhi-Jie Zhang, Xing Gao, Quan Shi, Xu Zhou

2022 23rd International Conference on Electronic Packaging Technology (ICEPT). 2022;

Link1

Interfacial Microstructure and Mechanical Reliability of Sn-58Bi/ENEPIG Solder Joints

Cheng Chen, Cheng Wang, Huhao Sun, Hongbo Yin, Xiuli Gao, Hengxu Xue, Dahai Ni, Kan Bian, Qilin Gu

Processes. 2022;10(2):295

Link1

Effects of Ni-P Bath on the Brittle Fracture of Sn-Ag-Cu Solder/ENEPIG Solder Joint

Kyoung-Ho Kim, Wonil Seo, Sang-Hyun Kwon, Jun-Ki Kim, Jeong-Won Yoon, Sehoon Yoo

Journal of Welding and Joining. 2017;35(3):1-6

Link1

Link2 Link3

Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging

Jungsoo Kim, Jong-Hoon Back, Seung-Boo Jung, Jeong-Won Yoon

Journal of Materials Science: Materials in Electronics. 2019;30(14):12911-12923

Link1

Link2 Link3

Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints

Ved Prakash Sharma, Naresh Varma Datla

Microelectronics Reliability. 2021;127:114381

Link1 Link2

This metadata service is kindly provided by CrossRef from May 29, 2014. J Weld Join has participated in CrossRef Text and Data Mining service since October 29, 2014.