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Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint

Jung-Hwan Bang, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee

J Weld Join. 2016;34(1):26-34. Published online 2016 February 29 DOI: https://doi.org/10.5781/JWJ.2016.34.1.26

Solder Joint Characterization

John H. Lau, Ning-Cheng Lee

Assembly and Reliability of Lead-Free Solder Joints. 2020;299-354

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Design for Reliability of Solder Joints

John H. Lau, Ning-Cheng Lee

Assembly and Reliability of Lead-Free Solder Joints. 2020;415-483

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Theory on Mechanics of Solder Materials

John Hock Lye Pang

Lead Free Solder. 2011;7-22

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Reliability Tests and Data Analyses of Solder Joints

John H. Lau, Ning-Cheng Lee

Assembly and Reliability of Lead-Free Solder Joints. 2020;355-413

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Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses

Satyanarayan, K.N. Prabhu

Materials Science Forum. 2015;830-831:265-269

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Erratum to: Theory on Mechanics of Solder Materials

J. H. L. Pang

Lead Free Solder. 2018;E1-E1

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Lead-free soldering: Materials science and solder joint reliability

Kejun Zeng

JOM. 2009;61(6):28-28

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Lead Free Solder

John Hock Lye Pang

. 2012;

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Modified Norris-Landzberg model for Pb-free solder joint reliability evaluation

Weidong Xie

Microelectronics Reliability. 2022;135:114590

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State of the Art of Lead-Free Solder Joint Reliability

John H. Lau

Journal of Electronic Packaging. 2020;143(2):

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