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Interfacial Reaction and Joint Strength of the Sn-58Bi Solder Paste with ENIG Surface Finished Substrate
Hyun-Pil Shin, Byung-Wook Ahn, Jee-Hyuk Ahn, Jong-Gun Lee, Kwang-Seok Kim, Duk-Hyun Kim, Seung-Boo Jung
J Weld Join. 2012;30(5):64-69.   Published online 2012 November 30    DOI: https://doi.org/10.5781/KWJS.2012.30.5.64

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Solder Joint Structure of Sn-58Bi Solder Paste with Epoxy-based Flux
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Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test
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Interfacial reactions between Sn–0.4Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction
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Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes
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Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere
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