 |
|
Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assisted Bonding
Shin-Il Kim, Dong-Yurl Yu, Yun-Chan Kim, Junhyuk Son, Dongjin Byun, Junghwan Bang
J Weld Join. 2023;41(4):291-298. Published online 2023 Aug 31 DOI: https://doi.org/10.5781/JWJ.2023.41.4.8
|
|
Citations to this article as recorded by
 Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation
Hyeri Go, Taejoon Noh, Seung-Boo Jung, Yoonchul Sohn
Crystals.2024; 14(5): 465. CrossRef
|