 |
|
Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with ENEPIG Surface Finish
Jieun Yu, Sujong Kim, Won Sik Hong, Namhyun Kang
J Weld Join. 2022;40(3):225-232. Published online 2022 Jun 24 DOI: https://doi.org/10.5781/JWJ.2022.40.3.3
|
|
Citations to this article as recorded by
 In-situ Observation and Modeling of Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with OSP and ENEPIG Surface Finish
Jieun Yu, Myeonghwan Choi, Dong-Yurl Yu, Won Sik Hong, Cheolho Park, Namhyun Kang
Electronic Materials Letters.2023; 19(3): 229. CrossRef Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package
Joo Young Bae, Mi-Song Kim, Hye Min Lee, Seul Gi Lee, Young-Woo Lee, Jeong Tak Moon, Won Sik Hong
Journal of Welding and Joining.2023; 41(5): 379. CrossRef Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes
So-Hee Hyun, Hye Min Lee, Mi-Song Kim, Won Sik Hong
Journal of Welding and Joining.2023; 41(5): 387. CrossRef
|