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Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with ENEPIG Surface Finish
Jieun Yu, Sujong Kim, Won Sik Hong, Namhyun Kang
J Weld Join. 2022;40(3):225-232. Published online 2022 Jun 24 DOI: https://doi.org/10.5781/JWJ.2022.40.3.3
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Citations to this article as recorded by
 In-situ Observation and Modeling of Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with OSP and ENEPIG Surface Finish
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