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Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles
Dong-Hwan Lee, Min-Haeng Heo, Jeong-Won Yoon
J Weld Join. 2022;40(3):233-241. Published online 2022 Jun 2 DOI: https://doi.org/10.5781/JWJ.2022.40.3.4
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Citations to this article as recorded by
 Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging
Dong-Bok Lee, Young-Jin Seo, Jeong-Won Yoon
Journal of Electronic Materials.2025; 54(3): 1592. CrossRef Optimization of TLPS Bonding Process and Joint Property using Ni-Sn Paste for High Temperature Power Module Applications
Da-Gyeong Han, Dong-Hwan Lee, Jeong-Won Yoon
Journal of Welding and Joining.2024; 42(2): 165. CrossRef
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