Strategies to Reduce Transient Liquid Phase Bonding Time for the Die Attach of Power Semiconductors
Sunghyun Sohn, Daewon Kim, Hongpyo Kim, Namhyun Kang
J Weld Join. 2020;38(2):158-165.   Published online 2020 Apr 29     DOI:
Citations to this article as recorded by Crossref logo
Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics
Hyejun Kang, Ashutosh Sharma, Jae Pil Jung
Metals.2020; 10(7): 934.     CrossRef