 |
|
Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications
Ashutosh Sharma, Do Hyun Jung, Ju Seon Cheon, Jae Pil Jung
J Weld Join. 2019;37(2):7-14. Published online 2019 Apr 30 DOI: https://doi.org/10.5781/JWJ.2019.37.2.2
|
|
Citations to this article as recorded by
 Sn–Bi–Ag Solder Enriched with Ta2O5 Nanoparticles for Flexible Mini-LED Microelectronic Packaging
Ashutosh Sharma, HyeJun Kang, Jae Pil Jung
ACS Applied Nano Materials.2024; 7(2): 1562. CrossRef Tailoring peel strength in UV-responsive, nonconductive adhesives via photocleavable epoxy for micro-LED bonding and repair
Nam-Gyu Jang, Ji Ho Kim, Mai Toan, Jin-Young Bae, Kiok Kwon, Seunghan Shin
Materials Today Communications.2024; 39: 108744. CrossRef Structural and optical analysis of film Sn6.3Pb93.7 prepared from coarse Sn63Pb37
Venkatarao Dadi, Swapna Peravali
Optical Materials.2022; 123: 111908. CrossRef Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes
Xinyue Wang, Zejun Zeng, Guoqi Zhang, Jing Zhang, Pan Liu
Journal of Electronic Packaging.2022;[Epub] CrossRef Diels–Alder Augmented Epoxies with Plasmonic Nanoparticle Fillers for Efficient Photothermal Depolymerization
Kavon D. Mojtabai, Samantha J. Lindholm, Brandon T. McReynolds, Nicole Penners, John D. McCoy, Sanchari Chowdhury, Youngmin Lee
ACS Applied Polymer Materials.2022; 4(4): 2703. CrossRef A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics
Mekala Bharath Krupa Teja, Ashutosh Sharma, Siddhartha Das, Karabi Das
Journal of Materials Science.2022; 57(19): 8597. CrossRef Hybrid Soldering 2.3D Assembly With High Reliability and Low Cost
Han-Wen Hu, Yu-Wei Huang, Yi-Chieh Tsai, Meng-Kai Shih, Kuan-Neng Chen
IEEE Journal of the Electron Devices Society.2022; 10: 791. CrossRef Effect of nano-phased bismuth–tin alloy surface coating on tribo-mechanical properties of basalt fiber reinforced composites
Vivek Dhand, Gyeonghun Han, Sanghoon Kim, Kyongyop Rhee
Journal of Materials Research and Technology.2022; 21: 2238. CrossRef Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin
Peng Zhang, Songbai Xue, Lu Liu, Jie Wu, Qingcheng Luo, Jianhao Wang
Polymers.2022; 14(23): 5303. CrossRef Microstructure of Epoxy-Based Composites: Fractal Nature Analysis
Ivana Stajcic, Aleksandar Stajcic, Cristina Serpa, Dana Vasiljevic-Radovic, Branislav Randjelovic, Vesna Radojevic, Hans Fecht
Fractal and Fractional.2022; 6(12): 741. CrossRef Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics
Hyejun Kang, Sri Harini Rajendran, Jae Pil Jung
Metals.2021; 11(2): 364. CrossRef Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining
Gwang-Mun Choi, Ki-Seok Jang, Kwang-Seong Choi, Jiho Joo, Ho-Gyeong Yun, Chanmi Lee, Yong-Sung Eom
Polymers.2021; 13(6): 957. CrossRef Reliability Evaluation of Epoxy Solder Joints for Medical Electronic Devices
Yu-Jae Jeon, Min-Soo Kang
Journal of the Korean Society of Manufacturing Tec.2021; 30(2): 127. CrossRef Recent Advancements in AI-Enabled Smart Electronics Packaging for Structural Health Monitoring
Vinamra Bhushan Sharma, Saurabh Tewari, Susham Biswas, Bharat Lohani, Umakant Dhar Dwivedi, Deepak Dwivedi, Ashutosh Sharma, Jae Pil Jung
Metals.2021; 11(10): 1537. CrossRef Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics
Hyejun Kang, Ashutosh Sharma, Jae Pil Jung
Metals.2020; 10(7): 934. CrossRef
|