 |
|
Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
J Weld Join. 2018;36(5):52-60. Published online 2018 Sep 17 DOI: https://doi.org/10.5781/JWJ.2018.36.5.7
|
|
Citations to this article as recorded by
 Bonding Properties of Package-on-Package Stack Interconnection Using by 150 ㎛ Height Copper Posts
Mi-Song Kim, So-Hee Hyun, Joo Young Bae, Won Sik Hong
Journal of Welding and Joining.2024; 42(4): 378. CrossRef Comparative study of laser- and reflow-soldered Sn–3.0Ag–0.5Cu joints on thin Au/Pd/Ni(P) substrate
Dong-Hwan Lee, Min-Seong Jeong, Jeong-Won Yoon
Journal of Materials Science: Materials in Electro.2023;[Epub] CrossRef Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong
Journal of Welding and Joining.2022; 40(2): 165. CrossRef Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing
Mi-Song Kim, Won Sik Hong, Myeongin Kim
Journal of Welding and Joining.2021; 39(4): 359. CrossRef
|