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Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder
Joint on the OSP Surface Finished PCB Substrate
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J Weld Join. 2018;36(2):14-20. Published online 2018 Apr 30 DOI: https://doi.org/10.5781/JWJ.2018.36.2.3
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Citations to this article as recorded by
 Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics
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Metals.2021; 11(2): 364. CrossRef Recent Low Temperature Solder of SnBi and Its Bonding Characteristics
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Journal of Welding and Joining.2020; 38(6): 576. CrossRef
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