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Interfacial reactions and mechanical strength of
Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
J Weld Join. 2017;35(6):51-58. Published online 2017 Dec 4 DOI: https://doi.org/10.5781/JWJ.2017.35.6.8
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