Development of Printed Circuit Heat Exchanger for Hydrogen Station using Diffusion Bonding
Jeong Kil Kim, Deog Nam Shim, Chil Yeong Seon, Ki Hoon Yang, Hae Ji Park, Dong Jin Kim
J Weld Join. 2017;35(5):57-64. Published online 2017 Sep 19 DOI: https://doi.org/10.5781/JWJ.2017.35.5.8
|
Citations to this article as recorded by
Direct diffusion bonding of 1060Al processed by surface activation with various doses of Ar ion bombardment
X.G. Song, W.L. Zhou, S.P. Hu, D.Y. Lin, W. Fu, Y.Y. Song, W.M. Long
Surfaces and Interfaces.2023; 41: 103285. CrossRef High-temperature mechanical behaviors of diffusion-welded Alloy 617
Injin Sah, Jong-Bae Hwang, Woo-Gon Kim, Eung-Seon Kim, Min-Hwan Kim
Nuclear Engineering and Design.2020; 364: 110617. CrossRef Design methodology and computational fluid analysis for the printed circuit steam generator (PCSG)
Sang Ji Kim, Taewoo Kim
Journal of Mechanical Science and Technology.2020; 34(12): 5303. CrossRef
|