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Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions
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Journal of KWJS. 2013;31(5):59-63. Published online 2013 Nov 5 DOI: https://doi.org/10.5781/KWJS.2013.31.5.59
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Citations to this article as recorded by
 Prediction of thermally induced failure for electronic equipment based on an artificial olfactory system
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