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Fabrication and Reliability Test of Device Embedded Flexible Module
Dae Gon Kim, Sung Taik Hong, Deok Heung Kim, Won Sik Hong, Chang-Woo Lee
Journal of KWJS. 2013;31(3):84-88. Published online 2013 Jun 30 DOI: https://doi.org/10.5781/KWJS.2013.31.3.84
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Citations to this article as recorded by
 Recent Progress in Flexible/Wearable Electronics
Seok Hee Kang, Suck Won Hong
Journal of Welding and Joining.2014; 32(3): 34. CrossRef Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions
Yun-Seong Jo, A Young Kim, Won Sik Hong
Journal of the Korean Welding and Joining Society.2013; 31(5): 59. CrossRef
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