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Volume 31(3); Jun 2013
Special Issues
2031503
Study on Joint of Micro Solder Bump for Application of Flexible Electronics
Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee
J Weld Join. 2013;31(3):4-10.   Published online June 30, 2013
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2031504
Various Cu Filling Methods of TSV for Three Dimensional Packaging
Myong-Hoon Roh, Jun-Hyeong Lee, Wonjoong Kim, Jae Pil Jung, Hyeong-Tea Kim
J Weld Join. 2013;31(3):11-16.   Published online June 30, 2013
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2031505
Mitigation Methods of Sn Whisker Growth on Pure Sn Plating
Keun-Soo Kim
J Weld Join. 2013;31(3):17-21.   Published online June 30, 2013
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2031506
Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics
Won Sik Hong, Chul Min Oh
J Weld Join. 2013;31(3):22-30.   Published online June 30, 2013
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Research Papers
2031508
Development of Push-pull Type Arc Welding Wire Feeder
Hyun-Jun Yoon, In-Sung Hwang, Dong-Cheol Kim, Moon-Jin Kang, Ki-Gab Choi
J Weld Join. 2013;31(3):39-43.   Published online July 10, 2013
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Prediction of Arc Welding Quality through Artificial Neural Network
Jungho Cho
J Weld Join. 2013;31(3):44-48.   Published online June 30, 2013
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2031510
Resistance Spot Welding Characteristics of Mg Alloy Using Process Tape
Dong-Soon Choi, Dong-Cheol Kim, Moon-Jin Kang
J Weld Join. 2013;31(3):49-53.   Published online June 30, 2013
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2031512
Characteristics of Plasma Emission Signals in Fiber Laser Welding of API Steel (Ⅲ)
Chang-Je Lee, Jong-Do Kim, Yu-Chan Kim
J Weld Join. 2013;31(3):60-65.   Published online June 30, 2013
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Effect of Coating Thickness on Microstructures and Tensile Properties in Yb:YAG Disk Laser Welds of Al-Si Coated Boron Steel
Wei-Ye Cao, Jong-Pan Kong, Yong-Nam Ahn, Cheol-Hee Kim, Chung-Yun Kang
J Weld Join. 2013;31(3):66-75.   Published online June 30, 2013
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Effect of Bonding Condition on the Tensile Properties of Diffusion Bonded Haynes230
Gil-Mo Kang, Ae-Jeong Jeon, Hong-Kyu Kim, Sung-Suk Hong, Chung-Yun Kang
J Weld Join. 2013;31(3):76-83.   Published online June 30, 2013
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Fabrication and Reliability Test of Device Embedded Flexible Module
Dae Gon Kim, Sung Taik Hong, Deok Heung Kim, Won Sik Hong, Chang-Woo Lee
J Weld Join. 2013;31(3):84-88.   Published online June 30, 2013
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