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Volume 25(2); Apr 2007
Laser Micro Bonding Technology
Joohan Kim, Chulku Lee
J Weld Join. 2007;25(2):1-2.   Published online May 17, 2007
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Ways to Improve Reliability against Stress-Relief Cracking in Weld Metal
Hee-Jin Kim, Hoi-Soo Ryoo
J Weld Join. 2007;25(2):3-5.   Published online May 17, 2007
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Flip-chip Bonding Technology and Reliability of Electronic Packaging
Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo et al.
J Weld Join. 2007;25(2):6-15.   Published online May 17, 2007
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Reliability Assessment for Electronic Assemblies with Electrical and Electrochemical Properties Measurement
Won-Sik Hong, Chul-Min Oh, Noh-Chang Park, Byung-Suk Song, Seung-Boo Jung
J Weld Join. 2007;25(2):16-23.   Published online May 17, 2007
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Formation of Through-Hole and Cu-Filling for 3 Dimensional Packaging Technology
Sung-Jun Hong, Ji-Hun Jun, Jae-Pil Jung
J Weld Join. 2007;25(2):24-30.   Published online May 17, 2007
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Recent Advances on Conductive Adhesives in Electronic Packaging
Jong-Min Kim
J Weld Join. 2007;25(2):31-36.   Published online May 17, 2007
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Standardization of Mechanical Test Method for Lead-Free Solder Paste - Shear Test Method for Chip Joint -
Jai-Hyun Park, Jong-Hyun Lee, Yong-Sik Ahn
J Weld Join. 2007;25(2):37-42.   Published online May 17, 2007
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A Study on the Mechanical Properties of Joints in Laser Transmission Joining of Polymers
Sang-Woo Cha, Jin-Beom Kim, Suk-Hwan Yoon, Suck-Joo Na
J Weld Join. 2007;25(2):43-48.   Published online May 17, 2007
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Automatic Multi-torch Welding System with High Speed
Hyeong-Soon Moon, Sung-Hoon Ko, Yong-Baek Kim
J Weld Join. 2007;25(2):49-54.   Published online May 17, 2007
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Mechanical Properties of the Flash Butt Welded Joint of 590MPa High Strength Steel
Boyoung Jeong, In-Su Woo, Jeong-Kil Kim, Jong-Bong Lee
J Weld Join. 2007;25(2):55-61.   Published online May 17, 2007
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Prediction Model for the Microstructure and Properties in Weld Heat Affected Zone : Ⅳ. Critical Particle Size for the Particle Coarsening Kinetics in Weld HAZ of Ti Added Low Alloyed Steel
Joonoh Moon, Sanghoon Kim, Hongchul Jeong, Jongbong Lee, Changhee Lee
J Weld Join. 2007;25(2):62-69.   Published online May 17, 2007
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Development of Simplified Formulas to Predict Deformations in Plate Bending Process with Oxy-Propane Gas Flame
Kang-Yul Bae, Young-Soo Yang, Chung-Min Hyun, Si-Hun Cho
J Weld Join. 2007;25(2):70-75.   Published online May 17, 2007
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Fabrication of Solder Bump Pattern Using Thin Mold
Dong-Jin Nam, Jae-Hak Lee, Choong-Don Yoo
J Weld Join. 2007;25(2):76-81.   Published online May 17, 2007
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Activation Energy for Intermetallic Compound Formation of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu Solder Joints
Won-Sik Hong, Whee-Sung Kim, Noh-Chang Park, Kwang-Bae Kim
J Weld Join. 2007;25(2):82-88.   Published online May 17, 2007
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IWJC-Korea 2007 Final Program
편집부
J Weld Join. 2007;25(2):89-89.   Published online May 17, 2007
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Welcome Messages
Dong-Hwan Park, Suck-Joo Na
J Weld Join. 2007;25(2):90-90.   Published online May 17, 2007
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News of the Korean Welding and Joining Society etc.
편집부
J Weld Join. 2007;25(2):107-111.   Published online May 17, 2007
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News of the Members etc.
편집부
J Weld Join. 2007;25(2):112-120.   Published online May 17, 2007
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