Advanced Search  
  Current Issue

Table of Contents | August, 2021  Vol. 39  No.4 Previous Issue | Next Issue | Archive
In this issue:

Research Paper
343 Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging   
Mi-Song Kim, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, Jeong Tak Moon
Journal of Welding and Joining:343-348.  Publication Date (Web): August 11, 2021
                  PDF Links
349 MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes   
Won Sik Hong, Mi-Song KIm, Myeongin Kim
Journal of Welding and Joining:349-358.  Publication Date (Web): August 11, 2021
                  PDF Links
359 Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing   
Mi-Song Kim, Won Sik Hong, Myeongin Kim
Journal of Welding and Joining:359-367.  Publication Date (Web): August 23, 2021
                  PDF Links
368 Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing   
Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park
Journal of Welding and Joining:368-375.  Publication Date (Web): August 26, 2021
                  PDF Links
376 A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste   
Jeong-Won Yoon, Dong-Hwan Lee, Byung-Suk Lee
Journal of Welding and Joining:376-383.  Publication Date (Web): August 23, 2021
                  PDF Links
384 Terminal Sinter-Bonding Using Silver Paste for Aluminum Nitride Heater   
Yun-Chan Kim, Dong-Yurl Yu, Junhyuk Son, Ji-Sung KIm, Min-Su Kim, Chang-Woo Lee, Jai-Won Byeon, Junghwan Bang
Journal of Welding and Joining:384-391.  Publication Date (Web): August 27, 2021
                  PDF Links
392 Penetration Depth Modeling and Process Parameter Maps for Laser Welds Using Machine Learning   
Bum-su Go, Hyeonjeong You, Hee-seon Bang, Cheolhee Kim
Journal of Welding and Joining:392-401.  Publication Date (Web): August 11, 2021
                  PDF Links
402 Thermal Conductivity Measurement Method for the Thin Epoxy Adhesive Joint Layer   
Da-In Lim, So-Jeong Lee, Seung-Boo Jung, Jun-Ki Kim
Journal of Welding and Joining:402-408.  Publication Date (Web): August 23, 2021
                  PDF Links
419 A Study on the Optimization of Welding Conditions for Titanium Drums Using GPS   
Won-Bin Oh, Ill-Soo Kim, Tae-Jong Yun, Bo-Ram Lee, Chung-Woo Lee, Bong-Yong Kang, Ji-Yeon Shim
Journal of Welding and Joining:419-426.  Publication Date (Web): August 23, 2021
                  PDF Links
427 Characteristic Analysis of Double Arcing on the Top Surface of STS304 in Plasma Arc Piercing   
Dong-Hyun Kim, Dae-Won Cho, Yeong-Kwan Jo, Jeong Suh, Kwang-Deok Choi, Ryoonhan Kim, Seokyoung Ahn
Journal of Welding and Joining:427-434.  Publication Date (Web): August 23, 2021
                  PDF Links
435 Welding Distortion Prediction for Multi-Seam Welded Pipe Structures using Equivalent Thermal Strain Method   
Chunbiao Wu, Chao Wang, Jae-Woong Kim
Journal of Welding and Joining:435-444.  Publication Date (Web): August 30, 2021
                  PDF Links
Review Paper
409 Thermal-induced Residual Stresses and Distortions in Friction Stir Welds - A Literature Review   
Mohamed H. El-Moayed, Ahmed Y. Shash, Mahmoud Abd Rabou, Mahmoud G. El-Sherbiny
Journal of Welding and Joining:409-418.  Publication Date (Web): August 11, 2021
                  PDF Links
endonote style file
vol: Issue: Page:
Register for e-submission
Register here to access the e-submission system of Journal of Welding and Joining for authors and reviewers.
Manuscript Submission
To submit a manuscript, please visit the Journal of Welding and Joining e-submission management system at, read the Instructions for Authors, and log into the Journal of Welding and Joining e-submission system. For assistance with manuscript submission, please contact:
Free archive
Anyone may access any past or current articles without logging in.
Editorial Office
#304, San-Jeong Building,
23, Gukhoe-daero 66-gil, Yeongdeungpo-gu, Seoul 07237, Korea
TEL : +82-2-538-6511    FAX : +82-2-538-6510   E-mail:
Browse Articles |  Current Issue |  For Authors and Reviewers |  About
Copyright© by The Korean Welding and Joining Society.           Developed in M2PI