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2032223
Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with ENEPIG Surface Finish
Jieun Yu, Sujong Kim, Won Sik Hong, Namhyun Kang
J Weld Join. 2022;40(3):225-232.   Published online June 24, 2022
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2032222
Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints
Mi-Song Kim, Won Sik Hong, Hye-Min Lee, Myeongin Kim
J Weld Join. 2022;40(3):207-214.   Published online June 20, 2022
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2032224
Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test
Myeongin Kim, Won Sik Hong, Mi-Song Kim
J Weld Join. 2022;40(3):271-277.   Published online June 2, 2022
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Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong
J Weld Join. 2022;40(2):165-174.   Published online April 21, 2022
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Microstructural Evolution of Cantilever Wire Probe after Touch-Down Fatigue Cycles for Power Semi-Conductor Wafer Testing
Won Sik Hong, Mi-Song Kim, Myeongin Kim
J Weld Join. 2021;39(6):677-683.   Published online December 6, 2021
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2032166
Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing
Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park
J Weld Join. 2021;39(4):368-375.   Published online August 26, 2021
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2032163
Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing
Mi-Song Kim, Won Sik Hong, Myeongin Kim
J Weld Join. 2021;39(4):359-367.   Published online August 23, 2021
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2032158
MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes
Won Sik Hong, Mi-Song KIm, Myeongin Kim
J Weld Join. 2021;39(4):349-358.   Published online August 11, 2021
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2032157
Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging
Mi-Song Kim, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, Jeong Tak Moon
J Weld Join. 2021;39(4):343-348.   Published online August 11, 2021
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2032011
Effect of Air-HAST Conditions on Sn Whisker Growth
Chulmin Oh, Sangjoo Oh, Dajung Kim, Won Sik Hong, Keun-Soo kIM
J Weld Join. 2019;37(2):21-25.   Published online April 22, 2019
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2032010
Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module
Mi-Song Kim, Chulmin Oh, Won Sik Hong
J Weld Join. 2019;37(2):15-20.   Published online April 19, 2019
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Ultrasonic Bonding Property of Aluminum Wire for Power Conversion Module of Automotive
Ji-Yeon Park, Chulmin Oh, Deok-Hee Won, Won Sik Hong
J Weld Join. 2018;36(3):57-64.   Published online June 12, 2018
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Cu Corrosion Test Method for Lead-Free Solders
Mi-Song Kim, Won Sik Hong, Chul Min Oh, Keun-Soo Kim
J Weld Join. 2017;35(3):21-27.   Published online June 30, 2017
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Effects of High Temperature-moisture on Corrosion and Mechanical Properties for Sn-system Solder Joints
Jeonga Kim, Yujin Park, Chul Min Oh et al.
J Weld Join. 2017;35(3):7-14.   Published online June 30, 2017
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Validation of sequence test method of Pb-free solder joint for automotive electronics
A Young Kim, Chul Min Oh, Won Sik Hong
J Weld Join. 2015;33(3):25-31.   Published online June 30, 2015
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