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Solder Joint Degradation and Electrochemical Metallic Ion Migration Property of Solder Joints with Surface Finish: Hye Min Lee, Mi-Song Kim, Won Sik Hong; J Weld Join. 2023;41(4):265-274. Published online August 31, 2023; DOI: https://doi.org/10.5781/JWJ.2023.41.4.5; Full text PubReader ePub Crossref - TDM PDF

Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with ENEPIG Surface Finish: Jieun Yu, Sujong Kim, Won Sik Hong, Namhyun Kang; J Weld Join. 2022;40(3):225-232. Published online June 24, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.3.3
Cited By 1; Full text PubReader ePub Crossref - TDM PDF

Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints: Mi-Song Kim, Won Sik Hong, Hye-Min Lee, Myeongin Kim; J Weld Join. 2022;40(3):207-214. Published online June 20, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.3.1; Full text PubReader ePub Crossref - TDM PDF

Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test: Myeongin Kim, Won Sik Hong, Mi-Song Kim; J Weld Join. 2022;40(3):271-277. Published online June 2, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.3.9; Full text PubReader ePub Crossref - TDM PDF

Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste: Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong; J Weld Join. 2022;40(2):165-174. Published online April 21, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.2.8
Cited By 1; Full text PubReader ePub Crossref - TDM PDF

Microstructural Evolution of Cantilever Wire Probe after Touch-Down Fatigue Cycles for Power Semi-Conductor Wafer Testing: Won Sik Hong, Mi-Song Kim, Myeongin Kim; J Weld Join. 2021;39(6):677-683. Published online December 6, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.6.13; Full text PubReader ePub Crossref - TDM PDF

Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing: Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park; J Weld Join. 2021;39(4):368-375. Published online August 26, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.4
Cited By 2; Full text PubReader ePub Crossref - TDM PDF

Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing: Mi-Song Kim, Won Sik Hong, Myeongin Kim; J Weld Join. 2021;39(4):359-367. Published online August 23, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.3
Cited By 8; Full text PubReader ePub Crossref - TDM PDF

MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes: Won Sik Hong, Mi-Song KIm, Myeongin Kim; J Weld Join. 2021;39(4):349-358. Published online August 11, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.2
Cited By 4; Full text PubReader ePub Crossref - TDM PDF

Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging: Mi-Song Kim, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, Jeong Tak Moon; J Weld Join. 2021;39(4):343-348. Published online August 11, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.1
Cited By 2; Full text PubReader ePub Crossref - TDM PDF

Effect of Air-HAST Conditions on Sn Whisker Growth: Chulmin Oh, Sangjoo Oh, Dajung Kim, Won Sik Hong, Keun-Soo kIM; J Weld Join. 2019;37(2):21-25. Published online April 22, 2019; DOI: https://doi.org/10.5781/JWJ.2019.37.2.4; Full text PubReader ePub Crossref - TDM PDF

Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module: Mi-Song Kim, Chulmin Oh, Won Sik Hong; J Weld Join. 2019;37(2):15-20. Published online April 19, 2019; DOI: https://doi.org/10.5781/JWJ.2019.37.2.3
Cited By 7; Full text PubReader ePub Crossref - TDM PDF

Ultrasonic Bonding Property of Aluminum Wire for Power Conversion Module of Automotive: Ji-Yeon Park, Chulmin Oh, Deok-Hee Won, Won Sik Hong; J Weld Join. 2018;36(3):57-64. Published online June 12, 2018; DOI: https://doi.org/10.5781/JWJ.2018.36.3.9
Cited By 3; Full text PubReader ePub Crossref - TDM PDF

Cu Corrosion Test Method for Lead-Free Solders: Mi-Song Kim, Won Sik Hong, Chul Min Oh, Keun-Soo Kim; J Weld Join. 2017;35(3):21-27. Published online June 30, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.3.4; Full text PubReader ePub Crossref - TDM PDF

Effects of High Temperature-moisture on Corrosion and Mechanical Properties for Sn-system Solder Joints: Jeonga Kim, Yujin Park, Chul Min Oh et al.; J Weld Join. 2017;35(3):7-14. Published online June 30, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.3.2; Full text PubReader ePub Crossref - TDM PDF

Volume 41, No. 4

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

MOST VIEWED MOST CITED

6,000	Review on the Recent Welding Research with Application of CNN-Based Deep Learning Part I: Models and Applications
5,252	Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration
4,324	Study on Laser Welding of Al-Cu Dissimilar Material by Green Laser and Weld Quality Evaluation by Deep Learning
3,953	Solidification Cracking Susceptibility of the Weld Metal of Additively Manufactured 316L Stainless Steel
3,909	Modeling of Laser Welds Using Machine Learning Algorithm Part I: Penetration Depth for Laser Overlap Al/Cu Dissimilar Metal Welds

Cited By 15	Review on the Recent Welding Research with Application of CNN-Based Deep Learning Part I: Models and Applications
Cited By 13	Solidification Cracking Susceptibility of the Weld Metal of Additively Manufactured 316L Stainless Steel
Cited By 13	Evaluating the Welding Pulses of Various Tool Profiles in Single-Pass Friction Stir Welding of 6082-T6 Aluminium Alloy
Cited By 10	Modeling of Laser Welds Using Machine Learning Algorithm Part II: Geometry and Mechanical Behaviors of Laser Overlap Welded High Strength Steel Sheets
Cited By 9	Review on the Recent Welding Research with Application of CNN-Based Deep Learning Part II: Model Evaluation and Visualizations

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