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368 Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing   
Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park
Journal of Welding and Joining:368-375.  Publication Date (Web): August 26, 2021
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359 Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing   
Mi-Song Kim, Won Sik Hong, Myeongin Kim
Journal of Welding and Joining:359-367.  Publication Date (Web): August 23, 2021
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349 MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes   
Won Sik Hong, Mi-Song KIm, Myeongin Kim
Journal of Welding and Joining:349-358.  Publication Date (Web): August 11, 2021
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