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Terminal Sinter-Bonding Using Silver Paste for Aluminum Nitride Heater
Yun-Chan Kim, Dong-Yurl Yu, Junhyuk Son et al.
J Weld Join. 2021;39(4):384-391.   Published online August 27, 2021
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Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module
Seungju Baek, Dong-Yurl Yu, Jun-Hyuk Son et al.
J Weld Join. 2020;38(4):366-373.   Published online August 24, 2020
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Study on Joint of Micro Solder Bump for Application of Flexible Electronics
Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee
J Weld Join. 2013;31(3):4-10.   Published online June 30, 2013
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Precise Joining Technology on Flexible Substrate by Using Micro-bumps
Min-Su Kim, Chang-Woo Lee
J Weld Join. 2012;30(5):1-3.   Published online November 30, 2012
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Effect of Curing Agent on the Curing Behavior and Joint Strength of Epoxy Adhesive
Min-Su Kim, Hae-Yeon Kim, Se-Hoon Yoo, Jong-Hoon Kim, Jun-Ki Kim
J Weld Join. 2011;29(4):54-60.   Published online September 12, 2011
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