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Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers
Min Jeong Ha, Ji-Ho Kim, Jae-Goo Han, Jin-Seok Yang, Jong-Min Kim, Byung-Seung Yim
J Weld Join. 2022;40(3):242-247.   Published online June 14, 2022
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Influence of Carbon Nanotube Concentration on the Interconnection Properties of Solderable Isotropic and Anisotropic Conductive Adhesive
Byung-Seung Yim, Hee Jun Youn, Jeong Il Lee, Jong-Min Kim
J Weld Join. 2020;38(2):152-157.   Published online April 23, 2020
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Investigations of Material Properties of Underfill Material for Mechanical Reliability Improvement of Electronic Devices
Byung-Seung Yim, Jin-Nam Kim, Jong-Min Kim
J Weld Join. 2019;37(5):477-481.   Published online September 19, 2019
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Influence of Reductant Content within the Solderable Polymer Composite on the Coalescence and Wetting Behaviors of Low-Melting-Point Alloy Fillers
Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
J Weld Join. 2019;37(1):76-81.   Published online January 24, 2019
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Reliability Properties of Carbon Nanotube-filled Solderable Anisotropic Conductive Adhesives
Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
J Weld Join. 2017;35(3):15-20.   Published online June 30, 2017
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ACF COB Bonding Process using Thermosonic
Yong Song, Byung-Seung Yim, Jin-Sik Joung, Jong-Min Kim
J Weld Join. 2011;29(1):25-28.   Published online March 4, 2011
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Electrically Conductive Adhesive using Low-melting-point Alloy and Bonding Process using Them
Byung-Seung Yim, Sung-Ho Jeon, Jong-Min Kim
J Weld Join. 2009;27(3):23-31.   Published online July 6, 2009
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High-Density Electronic Packaging Technology using Anisotropic Conductive Adhesives
Jin-Woon Lee, SeongHyuk Lee, Jong-Min Kim
J Weld Join. 2008;26(1):44-49.   Published online March 21, 2008
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Flow Characteristics and Filling Time Estimation for Underfill Process
Hyung-Sub Sim, Seong-Hyuk Lee, Jong-Min Kim, Young-Eui Shin
J Weld Join. 2007;25(3):45-50.   Published online July 19, 2007
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Recent Advances on Conductive Adhesives in Electronic Packaging
Jong-Min Kim
J Weld Join. 2007;25(2):31-36.   Published online May 17, 2007
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High Density Stacking Process and Reliability of Electronic Packaging
Young-Eui Shin, Jong-Min Kim, Young-Tark Kim, Joo-Seok Kim
J Weld Join. 2006;24(2):10-16.   Published online July 18, 2006
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Evaluation of Pul Strengths and Fracture Modes of Solder Joints by Modified Ball Pull Testing with Protrusion Jaw
Hyoung-Il Kim, Sung-Won Han, Jong-Min Kim, Myung-Ki Choi, Young-Eui Shin
J Weld Join. 2005;23(4):34-40.   Published online September 22, 2005
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Research for the Micro Packaging of Diamond Electron Emitter
Seung-Mock Lee, Jong-Min Kim
J Weld Join. 2005;23(2):41-46.   Published online May 12, 2005
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Electrically Conductive Adhesive Bonding Technology for Microsystems Packaging
Jong-Min Kim, Seung-Mock Lee, Young-Eui Shin
J Weld Join. 2005;23(2):18-22.   Published online May 12, 2005
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The Thermal Fatigue Analysis and Life Evaluation of Solder Joint for Flip Chip Package using Darveaux Model
Young-Eui Shin, Yeon-Sung Kim, Jong-Min Kim, Myun-Gi Choi
J Weld Join. 2004;22(6):36-42.   Published online January 26, 2005
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