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Deposition of a Porous Cu Layer by Electroplating and Feasibility Evaluation of Cu-Cu Die Attachment by Sinter Bonding Using Thermo-Compression
Doyeop Namgoong, Jong-Hyun Lee
J Weld Join. 2022;40(3):248-255.   Published online June 14, 2022
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Chip Sinter-Bonding Using Ag-Based Paste for Power Semiconductor Devices
Na Yeon Lee, Jong-Hyun Lee, Chang-Yong Hyun
J Weld Join. 2019;37(5):482-492.   Published online October 4, 2019
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High-speed Sintering of Ag-based Composite Ink by Nano-soldering
Woo Lim Choi, Jong-Hyun Lee
J Weld Join. 2018;36(2):7-13.   Published online April 11, 2018
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Epoxy solder paste and its applications
Jong-Tae Moon, Yong-Sung Eom, Jong-Hyun Lee
J Weld Join. 2015;33(3):32-39.   Published online June 30, 2015
TSV Interconnection Technology Using Solder Nanoparticles
Jong-Hyun Lee, Jong-Ho Yoon, Chang-Yong Hyun
J Weld Join. 2011;29(3):27-34.   Published online July 7, 2011
Standardization of Mechanical Test Method for Lead-Free Solder Paste - Shear Test Method for Chip Joint -
Jai-Hyun Park, Jong-Hyun Lee, Yong-Sik Ahn
J Weld Join. 2007;25(2):37-42.   Published online May 17, 2007
Necessity of Low Melting Temperature Pb-free Solder Alloy and Characteristics of Representative Alloys
Jong-Hyun Lee, Nam-Hyun Kang, Chang-Woo Lee, Jeong-Han Kim
J Weld Join. 2006;24(2):17-28.   Published online July 18, 2006

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