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A Review of the Brazeability of Low-Temperature and Nano-Reinforced Al-Based Brazing Filler Metals
Furkan, Hye-Jeong Kim, Gun-hwan Lee, Jae Pil Jung
J Weld Join. 2022;40(3):216-224.   Published online June 17, 2022
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Three-Dimesnional Semicondoctor Stacking using TSV(Through-Si-Via) Technology
Do Hoon Cho, Hye Jun Kang, Seong Min Seo, Jang Baeg Kim, Sri Harini Rajendran, Jae Pil Jung
J Weld Join. 2021;39(3):295-303.   Published online May 17, 2021
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Recent Low Temperature Solder of SnBi and Its Bonding Characteristics
Hyejun Kang, Bumgyu Baek, Jae Pil Jung
J Weld Join. 2020;38(6):576-583.   Published online December 3, 2020
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Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications
Ashutosh Sharma, Do Hyun Jung, Ju Seon Cheon, Jae Pil Jung
J Weld Join. 2019;37(2):7-14.   Published online April 30, 2019
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Plasma Electrolytic Oxidation in Surface Modification of Metals for Electronics
Mukesh Kumar Sharma, Youngjoo Jang, Jongmin Kim, Hyungtae Kim, Jae Pil Jung
J Weld Join. 2014;32(3):241-247.   Published online June 30, 2014
Various Cu Filling Methods of TSV for Three Dimensional Packaging
Myong-Hoon Roh, Jun-Hyeong Lee, Wonjoong Kim, Jae Pil Jung, Hyeong-Tea Kim
J Weld Join. 2013;31(3):11-16.   Published online June 30, 2013
Brazing Filler Metal and Process for Stainless Steel
Sung Chul Hong, Sang Yoon Park, Do Hyun Jung et al.
J Weld Join. 2012;30(6):15-20.   Published online December 23, 2012

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