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A Study on Aging Fracture Behavior of Sintered Joint by Bi-Modal Cu Paste: Junhyuk Son, Chang-Woo Lee, Dong-Yurl Yu, Dongjin Byun, Junghwan Bang; J Weld Join. 2022;40(6):540-546. Published online December 30, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.6.10; Full text PubReader ePub PDF

Terminal Sinter-Bonding Using Silver Paste for Aluminum Nitride Heater: Yun-Chan Kim, Dong-Yurl Yu, Junhyuk Son et al.; J Weld Join. 2021;39(4):384-391. Published online August 27, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.6
Cited By 1; Full text PubReader ePub PDF

A Study on Joint Properties of Sn-Cu-(X)Al-(Y)Si/Cu Solder by Multiple Reflow: Dong-Yurl Yu, Jun-Hyuk Son, Yong-Ho Ko, Chang-Woo Lee, Dongjin Byun, Junghwan Bang; J Weld Join. 2020;38(2):131-137. Published online April 28, 2020; DOI: https://doi.org/10.5781/JWJ.2020.38.2.1; Full text PubReader ePub PDF

Intermetallic Compounds and Mechanical Property of Sn-Cu-xCr/Cu Solder Joint by Multiple reflows Conditions: Dong-Yurl Yu, Junhyuk Son, Yong-Ho Ko, Chang-Woo Lee, Junghwan Bang; J Weld Join. 2018;36(2):21-27. Published online April 30, 2018; DOI: https://doi.org/10.5781/JWJ.2018.36.2.4; Full text PubReader ePub PDF

Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module: Junhyuk Son, Minkyung Kim, Dong-Yurl Yu et al.; J Weld Join. 2017;35(5):38-47. Published online September 26, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.5.6
Cited By 9; Full text PubReader ePub PDF

Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint: Jung-Hwan Bang, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee; J Weld Join. 2016;34(1):26-34. Published online February 29, 2016; DOI: https://doi.org/10.5781/JWJ.2016.34.1.26
Cited By 6; Full text PubReader ePub PDF

A study of joint properties of Sn-Cu-(X)Al(Si) middle-temperature solder for automotive electronics modules: Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang, Chang-Woo Lee; J Weld Join. 2015;33(3):19-24. Published online June 30, 2015; DOI: https://doi.org/10.5781/JWJ.2015.33.3.19
Cited By 1; PDF

Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling: Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee; J Weld Join. 2014;32(3):282-287. Published online June 30, 2014; DOI: https://doi.org/10.5781/JWJ.2014.32.3.68; PDF

Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging: Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee; J Weld Join. 2014;32(3):233-240. Published online June 30, 2014; DOI: https://doi.org/10.5781/JWJ.2014.32.3.19
Cited By 2; PDF

Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module: Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Jeonghan Kim, Chang-Woo Lee; J Weld Join. 2013;31(5):54-58. Published online November 5, 2013; DOI: https://doi.org/10.5781/KWJS.2013.31.5.54
Cited By 1; PDF

Fabrication and Reliability Test of Device Embedded Flexible Module: Dae Gon Kim, Sung Taik Hong, Deok Heung Kim, Won Sik Hong, Chang-Woo Lee; J Weld Join. 2013;31(3):84-88. Published online June 30, 2013; DOI: https://doi.org/10.5781/KWJS.2013.31.3.84
Cited By 2; PDF

Study on Joint of Micro Solder Bump for Application of Flexible Electronics: Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee; J Weld Join. 2013;31(3):4-10. Published online June 30, 2013; DOI: https://doi.org/10.5781/KWJS.2013.31.3.4
Cited By 3; PDF

Evaluation of Property and Reliability of Sn3.5Ag and Sn0.7Cu Pb-free Solder Joint by Complex Vibration for Application of Automobile Electric Module: Young-Ho Ko, Jung-Hwan Bang, Jeong-Han Kim, Chang-Woo Lee; J Weld Join. 2013;31(1):6-10. Published online June 4, 2013; DOI: https://doi.org/10.5781/KWJS.2013.31.1.6

Joint Reliability of Sn3.5Ag, Sn0.7Cu and Sn5.0Sb Pb-free Solder and Hybrids Joining Process for Application of Automobile Electric Module: Myong-Suk Kang, Jung-Hwan Bang, Chang-Woo Lee; J Weld Join. 2012;30(6):1-5. Published online December 23, 2012; DOI: https://doi.org/10.5781/KWJS.2012.30.6.1; PDF

Precise Joining Technology on Flexible Substrate by Using Micro-bumps: Min-Su Kim, Chang-Woo Lee; J Weld Join. 2012;30(5):1-3. Published online November 30, 2012; DOI: https://doi.org/10.5781/KWJS.2012.30.5.1; PDF

Volume 42, No. 1

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

MOST VIEWED MOST CITED

7,507	Review on Vacuum Laser Beam Welding
3,979	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
3,740	Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
3,688	Study on Laser Welding of Dissimilar Materials between Aluminum and Copper (Ⅰ) - Research Trend in Laser Welding Technology and Materials Testing Methods -
3,601	Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles

Cited By 8	Changes in the Mechanical Properties and Microstructure of High Manganese Steel by High Heat Input Welding and General Welding Processes
Cited By 7	Review on Vacuum Laser Beam Welding
Cited By 6	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
Cited By 6	Comparison of Welding Deformation Characteristics by Circumferential Welding for Austenitic and Duplex Stainless Steel Pipe : Experimental Study
Cited By 6	Development and Evaluation of Stainless Steel-Base Flux-Cored Wires for 9% Nickel Steel

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