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Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes: So-Hee Hyun, Hye Min Lee, Mi-Song Kim, Won Sik Hong; J Weld Join. 2023;41(5):387-395. Published online October 31, 2023; DOI: https://doi.org/10.5781/JWJ.2023.41.5.9; Full text PubReader ePub PDF

Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste: Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong; J Weld Join. 2022;40(2):165-174. Published online April 21, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.2.8
Cited By 3; Full text PubReader ePub PDF

Review on Vacuum Laser Beam Welding: Yongki Lee, Jason Cheon, Cheolhee Kim; J Weld Join. 2022;40(1):74-83. Published online February 9, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.1.8
Cited By 7; Full text PubReader ePub PDF

Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing: Mi-Song Kim, Won Sik Hong, Myeongin Kim; J Weld Join. 2021;39(4):359-367. Published online August 23, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.3
Cited By 11; Full text PubReader ePub PDF

MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes: Won Sik Hong, Mi-Song KIm, Myeongin Kim; J Weld Join. 2021;39(4):349-358. Published online August 11, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.2
Cited By 6; Full text PubReader ePub PDF

An Experiment Study for S/N Ratio of Bead Geometry for Guaranteeing the Welding Quality in Bellows Weld Joint: Jong-Pyo Lee, Ill-Soo Kim, Min-Ho Park, Byeong-Ju Jin, In-Ju Kim, Ji-Sun Kim; J Weld Join. 2017;35(2):43-51. Published online April 28, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.2.7; Full text PubReader ePub PDF

Research on Mechanical Properties and Characteristics of Hybrid Composites for Boat: Je-Hyoung Cho, Sung-Hoon Kim, Sung-Won Yoon, Jong-Rok Ha, Myung-Hyun Kim; J Weld Join. 2016;34(2):22-29. Published online April 30, 2016; DOI: https://doi.org/10.5781/JWJ.2016.34.2.22; Full text PubReader ePub PDF

A Study on Electron Beam Weldmetal Cross Section Shapes and Strength of Al 5052 Thick Plate: In-Ho Kim, Gil-Young Lee, Jeong-Min Ju, Kyoung-Tae Park, Byong-Sun Chun; J Weld Join. 2009;27(3):73-79. Published online July 6, 2009; PDF

Vacuum Plasma Sprayed NiTiZrSiSn Coating: Sanghoon Yoon, Juneseob Kim, Sooki Kim, Changhee Lee; J Weld Join. 2007;25(4):42-48. Published online September 21, 2007; PDF

Volume 42, No. 1

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

MOST VIEWED MOST CITED

7,500	Review on Vacuum Laser Beam Welding
3,968	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
3,732	Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
3,680	Study on Laser Welding of Dissimilar Materials between Aluminum and Copper (Ⅰ) - Research Trend in Laser Welding Technology and Materials Testing Methods -
3,594	Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles

Cited By 8	Changes in the Mechanical Properties and Microstructure of High Manganese Steel by High Heat Input Welding and General Welding Processes
Cited By 7	Review on Vacuum Laser Beam Welding
Cited By 6	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
Cited By 6	Comparison of Welding Deformation Characteristics by Circumferential Welding for Austenitic and Duplex Stainless Steel Pipe : Experimental Study
Cited By 6	Development and Evaluation of Stainless Steel-Base Flux-Cored Wires for 9% Nickel Steel

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