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2032222
Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints
Mi-Song Kim, Won Sik Hong, Hye-Min Lee, Myeongin Kim
J Weld Join. 2022;40(3):207-214.   Published online June 20, 2022
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2032224
Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test
Myeongin Kim, Won Sik Hong, Mi-Song Kim
J Weld Join. 2022;40(3):271-277.   Published online June 2, 2022
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Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong
J Weld Join. 2022;40(2):165-174.   Published online April 21, 2022
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2032166
Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing
Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park
J Weld Join. 2021;39(4):368-375.   Published online August 26, 2021
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2032163
Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing
Mi-Song Kim, Won Sik Hong, Myeongin Kim
J Weld Join. 2021;39(4):359-367.   Published online August 23, 2021
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2032158
MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes
Won Sik Hong, Mi-Song KIm, Myeongin Kim
J Weld Join. 2021;39(4):349-358.   Published online August 11, 2021
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