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2032214
Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles
Dong-Hwan Lee, Min-Haeng Heo, Jeong-Won Yoon
J Weld Join. 2022;40(3):233-241.   Published online June 2, 2022
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A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste
Jeong-Won Yoon, Dong-Hwan Lee, Byung-Suk Lee
J Weld Join. 2021;39(4):376-383.   Published online August 23, 2021
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Strategies to Reduce Transient Liquid Phase Bonding Time for the Die Attach of Power Semiconductors
Sunghyun Sohn, Daewon Kim, Hongpyo Kim, Namhyun Kang
J Weld Join. 2020;38(2):158-165.   Published online April 29, 2020
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2032038
Microstructure and Mechanical Properties of Friction-Welded Alloy 718 and SNCRW Stainless Steel After Post-Weld Heat-Treatment
Jeoung Han Kim, Nam-Yong Kim, Yu Sik Kong, Nho Kwang Park
J Weld Join. 2019;37(4):313-317.   Published online August 30, 2019
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Optimum Process Condition and Shear Strength of Transient Liquid Phase Bonded Cu/Sn/Ag and Ni/Sn/Ag Structures for Power Semiconductor Interconnect
Sunghyun Sohn, Jeonga Kim, Yujin Park, Kyung Mox Cho, Namhyun Kang
J Weld Join. 2019;37(4):363-368.   Published online August 28, 2019
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The Bonding Strength Characteristic of the Filler Metal Powder on the TLP Bonded Region of Superalloy GTD-111DS
In-Seok Oh, Gil-Moo Kim, Byeong-Shik Moon
J Weld Join. 2007;25(5):45-50.   Published online December 3, 2007
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Dissolution Phenomenon of the Base Metal during TLP Bonding Using the Modified Base Metal Powder and Ni Base Filler Metal Powder
Woo-young Song, Chang-ho Ye, Chung-yun Kang
J Weld Join. 2007;25(3):64-71.   Published online July 19, 2007
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