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2032329
Thermal Cycling Performance of Heterogeneous Solder Ball Joints with Sn-3.0Ag-0.5Cu and Sn-0.75Cu(-Ni,Bi) Solder Ball Composition for BGA Package
Joo Young Bae, Mi-Song Kim, So-Hee Hyun et al.
J Weld Join. 2024;42(2):174-183.   Published online April 30, 2024
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2032293
Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package
Joo Young Bae, Mi-Song Kim, Hye Min Lee et al.
J Weld Join. 2023;41(5):379-386.   Published online October 31, 2023
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2032224
Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test
Myeongin Kim, Won Sik Hong, Mi-Song Kim
J Weld Join. 2022;40(3):271-277.   Published online June 2, 2022
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