Advanced Search  
 JWJ Search

368 Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing   
Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park
Journal of Welding and Joining:368-375.  Publication Date (Web): August 26, 2021
                  PDF Links
349 MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes   
Won Sik Hong, Mi-Song KIm, Myeongin Kim
Journal of Welding and Joining:349-358.  Publication Date (Web): August 11, 2021
                  PDF Links
7 High-speed Sintering of Ag-based Composite Ink by Nano-soldering   
Woo Lim Choi, Jong-Hyun Lee
Journal of Welding and Joining:7-13.  Publication Date (Web): April 11, 2018
                  PDF Links
99 Improvement of Solder Joint Strength in SAC 305 Solder Ball to ENIG Substrate Using LF Hydrogen Radical Treatment
Ah-reum Lee, Seung-jae Jo, Jai-hyun Park, Chung-yun Kang
Journal of Welding and Joining:99-106.  Publication Date (Web): March 4, 2011
PDF Links
85 Research of Optimum Reflow Process Condition for 0402 Electric Parts
Junghwan Bang, Sehyung Lee, Yueseon Shin, Jeonghan Kim, Changwoo Lee
Journal of Welding and Joining:85-89.  Publication Date (Web): March 12, 2009
PDF Links
30 A Study on the Optimization of IR Laser Flip-chip Bonding Process Using Taguchi Methods
Chun-Sam Song, Hyun-Sik Ji, Joohan Kim, Jong-Hyeong Kim, Hyo-Sok Ahn
Journal of Welding and Joining:30-36.  Publication Date (Web): July 31, 2008
PDF Links
1 |
endonote style file
vol: Issue: Page:
Register for e-submission
Register here to access the e-submission system of Journal of Welding and Joining for authors and reviewers.
Manuscript Submission
To submit a manuscript, please visit the Journal of Welding and Joining e-submission management system at, read the Instructions for Authors, and log into the Journal of Welding and Joining e-submission system. For assistance with manuscript submission, please contact:
Free archive
Anyone may access any past or current articles without logging in.
Editorial Office
#304, San-Jeong Building,
23, Gukhoe-daero 66-gil, Yeongdeungpo-gu, Seoul 07237, Korea
TEL : +82-2-538-6511    FAX : +82-2-538-6510   E-mail:
Browse Articles |  Current Issue |  For Authors and Reviewers |  About
Copyright© by The Korean Welding and Joining Society.           Developed in M2PI