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2032223
Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with ENEPIG Surface Finish
Jieun Yu, Sujong Kim, Won Sik Hong, Namhyun Kang
J Weld Join. 2022;40(3):225-232.   Published online June 24, 2022
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2032158
MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes
Won Sik Hong, Mi-Song KIm, Myeongin Kim
J Weld Join. 2021;39(4):349-358.   Published online August 11, 2021
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Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu et al.
J Weld Join. 2017;35(5):38-47.   Published online September 26, 2017
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Effects of High Temperature-moisture on Corrosion and Mechanical Properties for Sn-system Solder Joints
Jeonga Kim, Yujin Park, Chul Min Oh et al.
J Weld Join. 2017;35(3):7-14.   Published online June 30, 2017
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Validation of sequence test method of Pb-free solder joint for automotive electronics
A Young Kim, Chul Min Oh, Won Sik Hong
J Weld Join. 2015;33(3):25-31.   Published online June 30, 2015
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Degradation Characteristics of Eutectic and Pb-free Solder Joint of Electronics mounted for Automotive Engine
A Young Kim, Won Sik Hong
J Weld Join. 2014;32(3):288-294.   Published online June 30, 2014
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2031506
Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics
Won Sik Hong, Chul Min Oh
J Weld Join. 2013;31(3):22-30.   Published online June 30, 2013
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Activation Energy for Intermetallic Compound Formation of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu Solder Joints
Won-Sik Hong, Whee-Sung Kim, Noh-Chang Park, Kwang-Bae Kim
J Weld Join. 2007;25(2):82-88.   Published online May 17, 2007
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