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349 MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes   
Won Sik Hong, Mi-Song KIm, Myeongin Kim
Journal of Welding and Joining:349-358.  Publication Date (Web): August 11, 2021
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38 Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module   
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee, Young-Bae Park, Junghwan Bang
Journal of Welding and Joining:38-47.  Publication Date (Web): September 26, 2017   Cited by 8
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7 Effects of High Temperature-moisture on Corrosion and Mechanical Properties for Sn-system Solder Joints   
Jeonga Kim, Yujin Park, Chul Min Oh, Won Sik Hong, Yong-Ho Ko, Sungdo Ahn, Namhyun Kang
Journal of Welding and Joining:7-14.  Publication Date (Web): June 30, 2017
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25 Validation of sequence test method of Pb-free solder joint for automotive electronics   
A Young Kim, Chul Min Oh, Won Sik Hong
Journal of Welding and Joining:25-31.  Publication Date (Web): June 30, 2015
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288 Degradation Characteristics of Eutectic and Pb-free Solder Joint of Electronics mounted for Automotive Engine   
A Young Kim, Won Sik Hong
Journal of Welding and Joining:288-294.  Publication Date (Web): June 30, 2014   Cited by 1
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22 Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics   
Won Sik Hong, Chul Min Oh
Journal of Welding and Joining:22-30.  Publication Date (Web): June 30, 2013   Cited by 5
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82 Activation Energy for Intermetallic Compound Formation of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu Solder Joints
Won-Sik Hong, Whee-Sung Kim, Noh-Chang Park, Kwang-Bae Kim
Journal of Welding and Joining:82-88.  Publication Date (Web): May 17, 2007
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