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384 Terminal Sinter-Bonding Using Silver Paste for Aluminum Nitride Heater   
Yun-Chan Kim, Dong-Yurl Yu, Junhyuk Son, Ji-Sung KIm, Min-Su Kim, Chang-Woo Lee, Jai-Won Byeon, Junghwan Bang
Journal of Welding and Joining:384-391.  Publication Date (Web): August 27, 2021
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376 A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste   
Jeong-Won Yoon, Dong-Hwan Lee, Byung-Suk Lee
Journal of Welding and Joining:376-383.  Publication Date (Web): August 23, 2021
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368 Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing   
Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park
Journal of Welding and Joining:368-375.  Publication Date (Web): August 26, 2021
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359 Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing   
Mi-Song Kim, Won Sik Hong, Myeongin Kim
Journal of Welding and Joining:359-367.  Publication Date (Web): August 23, 2021
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349 MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes   
Won Sik Hong, Mi-Song KIm, Myeongin Kim
Journal of Welding and Joining:349-358.  Publication Date (Web): August 11, 2021
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89 Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration   
Sujong Kim, Wonsik Hong, Hyunbin Nam, Namhyun Kang
Journal of Welding and Joining:89-102.  Publication Date (Web): February 26, 2021   Cited by 3
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576 Recent Low Temperature Solder of SnBi and Its Bonding Characteristics   
Hyejun Kang, Bumgyu Baek, Jae Pil Jung
Journal of Welding and Joining:576-583.  Publication Date (Web): December 3, 2020
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7 Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications   
Ashutosh Sharma, Do Hyun Jung, Ju Seon Cheon, Jae Pil Jung
Journal of Welding and Joining:7-14.  Publication Date (Web): April 30, 2019   Cited by 4
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52 Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints   
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
Journal of Welding and Joining:52-60.  Publication Date (Web): September 17, 2018   Cited by 1
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78 A Study on the Electrochemical Corrosion Property of Sn-xSb Solder Alloy   
Junhyuk Son, Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang
Journal of Welding and Joining:78-82.  Publication Date (Web): June 19, 2018   Cited by 1
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7 High-speed Sintering of Ag-based Composite Ink by Nano-soldering   
Woo Lim Choi, Jong-Hyun Lee
Journal of Welding and Joining:7-13.  Publication Date (Web): April 11, 2018
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51 Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint   
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
Journal of Welding and Joining:51-58.  Publication Date (Web): December 4, 2017   Cited by 4
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38 Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module   
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee, Young-Bae Park, Junghwan Bang
Journal of Welding and Joining:38-47.  Publication Date (Web): September 26, 2017   Cited by 8
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21 Cu Corrosion Test Method for Lead-Free Solders   
Mi-Song Kim, Won Sik Hong, Chul Min Oh, Keun-Soo Kim
Journal of Welding and Joining:21-27.  Publication Date (Web): June 30, 2017
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7 Effects of High Temperature-moisture on Corrosion and Mechanical Properties for Sn-system Solder Joints   
Jeonga Kim, Yujin Park, Chul Min Oh, Won Sik Hong, Yong-Ho Ko, Sungdo Ahn, Namhyun Kang
Journal of Welding and Joining:7-14.  Publication Date (Web): June 30, 2017
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26 Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint   
Jung-Hwan Bang, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee
Journal of Welding and Joining:26-34.  Publication Date (Web): February 29, 2016   Cited by 5
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32 Epoxy solder paste and its applications   
Jong-Tae Moon, Yong-Sung Eom, Jong-Hyun Lee
Journal of Welding and Joining:32-39.  Publication Date (Web): June 30, 2015   Cited by 3
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25 Validation of sequence test method of Pb-free solder joint for automotive electronics   
A Young Kim, Chul Min Oh, Won Sik Hong
Journal of Welding and Joining:25-31.  Publication Date (Web): June 30, 2015
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19 A study of joint properties of Sn-Cu-(X)Al(Si) middle-temperature solder for automotive electronics modules   
Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang, Chang-Woo Lee
Journal of Welding and Joining:19-24.  Publication Date (Web): June 30, 2015   Cited by 1
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611 Degradation Behavior of Eutectic and Pb-free Solder Plated Ribbon in Crystalline Silicon Photovoltaic Module   
Ju-Hee Kim, A Yong Kim, Nochang Park, Jeong Won Ha, Sang Guon Lee, Won Sik Hong
Journal of Welding and Joining:611-617.  Publication Date (Web): December 31, 2014
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288 Degradation Characteristics of Eutectic and Pb-free Solder Joint of Electronics mounted for Automotive Engine   
A Young Kim, Won Sik Hong
Journal of Welding and Joining:288-294.  Publication Date (Web): June 30, 2014   Cited by 1
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282 Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling   
Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining:282-287.  Publication Date (Web): June 30, 2014
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267 Impact of External Temperature Environment on Large FCBGA Sn-Ag-Cu Solder Interconnect Board Level Mechanical Shock Performance   
Tae-Kyu Lee
Journal of Welding and Joining:267-273.  Publication Date (Web): June 30, 2014
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54 Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module   
Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Jeonghan Kim, Chang-Woo Lee
Journal of Welding and Joining:54-58.  Publication Date (Web): November 5, 2013   Cited by 1
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22 Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics   
Won Sik Hong, Chul Min Oh
Journal of Welding and Joining:22-30.  Publication Date (Web): June 30, 2013   Cited by 5
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4 Study on Joint of Micro Solder Bump for Application of Flexible Electronics   
Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining:4-10.  Publication Date (Web): June 30, 2013   Cited by 2
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64 Interfacial Reaction and Joint Strength of the Sn-58Bi Solder Paste with ENIG Surface Finished Substrate
Hyun-Pil Shin, Byung-Wook Ahn, Jee-Hyuk Ahn, Jong-Gun Lee, Kwang-Seok Kim, Duk-Hyun Kim, Seung-Boo Jung
Journal of Welding and Joining:64-69.  Publication Date (Web): November 30, 2012
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38 Active Metal Brazing Applied to Joining of ZrO2-Ti Alloy
Se-Ho Kee, Sang-Yoon Park, Jae-Pil Jung, Won-Joong Kim
Journal of Welding and Joining:38-43.  Publication Date (Web): July 18, 2012
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65 Behavior of Vibration Fracture for Sn-Ag-Cu-X Solders by Soldering
Sanghun Jin, Namhyun Kang, Kyung-mox Cho, Changwoo Lee, Wonsik Hong
Journal of Welding and Joining:65-69.  Publication Date (Web): May 16, 2012
PDF Links
 
95 Flux residue effect on the electrochemical migration of Sn-3.0Ag-0.5Cu
Junghwan. Bang, Changwoo. Lee
Journal of Welding and Joining:95-98.  Publication Date (Web): November 22, 2011
PDF Links
 
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