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Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes: So-Hee Hyun, Hye Min Lee, Mi-Song Kim, Won Sik Hong; J Weld Join. 2023;41(5):387-395. Published online October 31, 2023; DOI: https://doi.org/10.5781/JWJ.2023.41.5.9; Full text PubReader ePub PDF

Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints: Mi-Song Kim, Won Sik Hong, Hye-Min Lee, Myeongin Kim; J Weld Join. 2022;40(3):207-214. Published online June 20, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.3.1
Cited By 1; Full text PubReader ePub PDF

Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste: Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong; J Weld Join. 2022;40(2):165-174. Published online April 21, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.2.8
Cited By 3; Full text PubReader ePub PDF

Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing: Mi-Song Kim, Won Sik Hong, Myeongin Kim; J Weld Join. 2021;39(4):359-367. Published online August 23, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.3
Cited By 11; Full text PubReader ePub PDF

MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes: Won Sik Hong, Mi-Song KIm, Myeongin Kim; J Weld Join. 2021;39(4):349-358. Published online August 11, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.2
Cited By 6; Full text PubReader ePub PDF

A Study on Joint Properties of Sn-Cu-(X)Al-(Y)Si/Cu Solder by Multiple Reflow: Dong-Yurl Yu, Jun-Hyuk Son, Yong-Ho Ko, Chang-Woo Lee, Dongjin Byun, Junghwan Bang; J Weld Join. 2020;38(2):131-137. Published online April 28, 2020; DOI: https://doi.org/10.5781/JWJ.2020.38.2.1; Full text PubReader ePub PDF

Intermetallic Compounds and Mechanical Property of Sn-Cu-xCr/Cu Solder Joint by Multiple reflows Conditions: Dong-Yurl Yu, Junhyuk Son, Yong-Ho Ko, Chang-Woo Lee, Junghwan Bang; J Weld Join. 2018;36(2):21-27. Published online April 30, 2018; DOI: https://doi.org/10.5781/JWJ.2018.36.2.4; Full text PubReader ePub PDF

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint: Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon; J Weld Join. 2017;35(6):51-58. Published online December 4, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.6.8
Cited By 6; Full text PubReader ePub PDF

Volume 42, No. 1

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

MOST VIEWED MOST CITED

7,480	Review on Vacuum Laser Beam Welding
3,947	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
3,710	Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
3,646	Study on Laser Welding of Dissimilar Materials between Aluminum and Copper (Ⅰ) - Research Trend in Laser Welding Technology and Materials Testing Methods -
3,562	Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles

Cited By 8	Changes in the Mechanical Properties and Microstructure of High Manganese Steel by High Heat Input Welding and General Welding Processes
Cited By 7	Review on Vacuum Laser Beam Welding
Cited By 6	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
Cited By 6	Comparison of Welding Deformation Characteristics by Circumferential Welding for Austenitic and Duplex Stainless Steel Pipe : Experimental Study
Cited By 6	Development and Evaluation of Stainless Steel-Base Flux-Cored Wires for 9% Nickel Steel

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