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Microstructural Evolution of Cantilever Wire Probe after Touch-Down Fatigue Cycles for Power Semi-Conductor Wafer Testing
Won Sik Hong, Mi-Song Kim, Myeongin Kim
J Weld Join. 2021;39(6):677-683.   Published online December 6, 2021
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Strategies to Reduce Transient Liquid Phase Bonding Time for the Die Attach of Power Semiconductors
Sunghyun Sohn, Daewon Kim, Hongpyo Kim, Namhyun Kang
J Weld Join. 2020;38(2):158-165.   Published online April 29, 2020
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Microstructure and Mechanical Properties of Friction-Welded Alloy 718 and SNCRW Stainless Steel After Post-Weld Heat-Treatment
Jeoung Han Kim, Nam-Yong Kim, Yu Sik Kong, Nho Kwang Park
J Weld Join. 2019;37(4):313-317.   Published online August 30, 2019
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Optimum Process Condition and Shear Strength of Transient Liquid Phase Bonded Cu/Sn/Ag and Ni/Sn/Ag Structures for Power Semiconductor Interconnect
Sunghyun Sohn, Jeonga Kim, Yujin Park, Kyung Mox Cho, Namhyun Kang
J Weld Join. 2019;37(4):363-368.   Published online August 28, 2019
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