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Thermal Cycling Performance of Heterogeneous Solder Ball Joints with Sn-3.0Ag-0.5Cu and Sn-0.75Cu(-Ni,Bi) Solder Ball Composition for BGA Package
Joo Young Bae, Mi-Song Kim, So-Hee Hyun et al.
J Weld Join. 2024;42(2):174-183.   Published online April 30, 2024
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Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu et al.
J Weld Join. 2017;35(5):38-47.   Published online September 26, 2017
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Validation of sequence test method of Pb-free solder joint for automotive electronics
A Young Kim, Chul Min Oh, Won Sik Hong
J Weld Join. 2015;33(3):25-31.   Published online June 30, 2015
Active Metal Brazing Applied to Joining of ZrO2-Ti Alloy
Se-Ho Kee, Sang-Yoon Park, Jae-Pil Jung, Won-Joong Kim
J Weld Join. 2012;30(3):38-43.   Published online July 18, 2012
Behavior of Vibration Fracture for Sn-Ag-Cu-X Solders by Soldering
Sanghun Jin, Namhyun Kang, Kyung-mox Cho, Changwoo Lee, Wonsik Hong
J Weld Join. 2012;30(2):65-69.   Published online May 16, 2012
Flux residue effect on the electrochemical migration of Sn-3.0Ag-0.5Cu
Junghwan. Bang, Changwoo. Lee
J Weld Join. 2011;29(5):95-98.   Published online November 22, 2011
Research of Optimum Reflow Process Condition for 0402 Electric Parts
Junghwan Bang, Sehyung Lee, Yueseon Shin, Jeonghan Kim, Changwoo Lee
J Weld Join. 2009;27(1):85-89.   Published online March 12, 2009

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