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2032366
Tensile Strength Property with PdCo-Cu Multi-Layer Lamination and Heat Treatment of MEMS Probe for Probe Card
So-Hee Hyun, Mi-Song Kim, Won Sik Hong, Jae-Hyung Lee, Tae-Jong Lee
J Weld Join. 2024;42(5):560-566.   Published online October 31, 2024
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2032224
Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test
Myeongin Kim, Won Sik Hong, Mi-Song Kim
J Weld Join. 2022;40(3):271-277.   Published online June 2, 2022
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2032166
Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing
Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park
J Weld Join. 2021;39(4):368-375.   Published online August 26, 2021
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