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2032284
Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assisted Bonding
Shin-Il Kim, Dong-Yurl Yu, Yun-Chan Kim, Junhyuk Son, Dongjin Byun, Junghwan Bang
J Weld Join. 2023;41(4):291-298.   Published online August 31, 2023
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Cu Corrosion Test Method for Lead-Free Solders
Mi-Song Kim, Won Sik Hong, Chul Min Oh, Keun-Soo Kim
J Weld Join. 2017;35(3):21-27.   Published online June 30, 2017
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Effects of High Temperature-moisture on Corrosion and Mechanical Properties for Sn-system Solder Joints
Jeonga Kim, Yujin Park, Chul Min Oh et al.
J Weld Join. 2017;35(3):7-14.   Published online June 30, 2017
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2031728
Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint
Jung-Hwan Bang, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee
J Weld Join. 2016;34(1):26-34.   Published online February 29, 2016
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2031687
A study of joint properties of Sn-Cu-(X)Al(Si) middle-temperature solder for automotive electronics modules
Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang, Chang-Woo Lee
J Weld Join. 2015;33(3):19-24.   Published online June 30, 2015
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2031506
Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics
Won Sik Hong, Chul Min Oh
J Weld Join. 2013;31(3):22-30.   Published online June 30, 2013
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2031505
Mitigation Methods of Sn Whisker Growth on Pure Sn Plating
Keun-Soo Kim
J Weld Join. 2013;31(3):17-21.   Published online June 30, 2013
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Estimation of Mechanical Properties of Sn-xAg-0.5Cu Lead-free Solder by Tensile Test
Jong-Seol Jeong, Ki-Hoon Shin, Jong-Hyeong Kim
J Weld Join. 2011;29(1):41-45.   Published online March 4, 2011
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Characteristics of Sn-1.7Bi-0.7Cu-0.6In Lead-free Solder
Ji-Ho Park, Hee-Yul Lee, Ji-Heon Jhun, Chu-Seon Cheon, Jae-Pil Jung
J Weld Join. 2008;26(5):43-48.   Published online November 12, 2008
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