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2032284
Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assisted Bonding
Shin-Il Kim, Dong-Yurl Yu, Yun-Chan Kim, Junhyuk Son, Dongjin Byun, Junghwan Bang
J Weld Join. 2023;41(4):291-298.   Published online August 31, 2023
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Study on the Microstructure and Mechanical Properties of Butt GMAW Al/Fe Dissimilar Joints using Pure Copper Filler Metal
Ju-Hee Jung, Dae-Woong Park, Eung-Ryul Baek
J Weld Join. 2021;39(6):641-648.   Published online December 9, 2021
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Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration
Sujong Kim, Wonsik Hong, Hyunbin Nam, Namhyun Kang
J Weld Join. 2021;39(1):89-102.   Published online February 26, 2021
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2032038
Microstructure and Mechanical Properties of Friction-Welded Alloy 718 and SNCRW Stainless Steel After Post-Weld Heat-Treatment
Jeoung Han Kim, Nam-Yong Kim, Yu Sik Kong, Nho Kwang Park
J Weld Join. 2019;37(4):313-317.   Published online August 30, 2019
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Optimum Process Condition and Shear Strength of Transient Liquid Phase Bonded Cu/Sn/Ag and Ni/Sn/Ag Structures for Power Semiconductor Interconnect
Sunghyun Sohn, Jeonga Kim, Yujin Park, Kyung Mox Cho, Namhyun Kang
J Weld Join. 2019;37(4):363-368.   Published online August 28, 2019
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