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2032353
Recent Advences in Laser and Laser-Assisted Bonding (LAB) Technologies for Micro-Soldering and Applications to Mini-LED
Jun Ho Ku, Jae Pil Jung
J Weld Join. 2024;42(4):428-436.   Published online August 31, 2024
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Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module
Seungju Baek, Dong-Yurl Yu, Jun-Hyuk Son et al.
J Weld Join. 2020;38(4):366-373.   Published online August 24, 2020
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2032080
A Study on Joint Properties of Sn-Cu-(X)Al-(Y)Si/Cu Solder by Multiple Reflow
Dong-Yurl Yu, Jun-Hyuk Son, Yong-Ho Ko, Chang-Woo Lee, Dongjin Byun, Junghwan Bang
J Weld Join. 2020;38(2):131-137.   Published online April 28, 2020
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Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
J Weld Join. 2018;36(5):52-60.   Published online September 17, 2018
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2031749
Effect of Tool Plunge Depth on Weldability of Dissimilar Al5083-O/DP590 Friction Spot Joint
Su-Ok Jeong, Han-Sur Bang, Hee-Seon Bang
J Weld Join. 2016;34(3):17-22.   Published online June 30, 2016
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2031687
A study of joint properties of Sn-Cu-(X)Al(Si) middle-temperature solder for automotive electronics modules
Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang, Chang-Woo Lee
J Weld Join. 2015;33(3):19-24.   Published online June 30, 2015
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Interfacial Reaction and Joint Strength of the Sn-58Bi Solder Paste with ENIG Surface Finished Substrate
Hyun-Pil Shin, Byung-Wook Ahn, Jee-Hyuk Ahn et al.
J Weld Join. 2012;30(5):64-69.   Published online November 30, 2012
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